High-performance, power-efficient design platforms for system-level differentiation
GLOBALFOUNDRIES application-specific integrated circuit (ASIC) offerings are designed to deliver system-level differentiation in semiconductors for next-generation cloud, computing, storage, and mobile and wired network-infrastructure applications. The ASICs build on ongoing innovation and investment, and bring together an industry-unique combination of strengths:
- Advanced process technologies
- Rich intellectual property (IP) portfolio, including world-class SerDes, state-of-the-art embedded TCAMs, and high-performance and density-optimized embedded SRAMs
- Comprehensive design methodology
- Future-ready packaging options
- World-class ASIC expertise, featuring deep, long-term experience collaboratively solving customer design challenges
The FX-14™ design system, GLOBALFOUNDRIES latest ASIC offering, enables chip designers to take performance and power efficiency to new levels. The FX-14 ASIC takes advantage of 14nm FinFET process technology and an enhanced IP portfolio that features leading-edge 64-bit cores, an innovative 56G high-speed SerDes offering, and advanced embedded memories.
A comprehensive ASIC design methodology enables seamless integration of these IP building blocks using industry-standard design tools and flows. Refined over years of developing and manufacturing chips for the most demanding high-performance systems, the methodology is optimized to help enable first-pass design success and faster time to market.
The ASIC packaging portfolio leverages forward-thinking advances to help meet the toughest design objectives. Packaging innovations available in the FX-14 and Cu-32 ASIC design systems include high-performance substrate build-up materials, system-in-package configurations, and 2.5D and 3D die stacking architectures.
Flexible ASIC business engagement models give you the ability to supplement in-house resources with the level of support you need from GLOBALFOUNDRIES experienced chip design, methodology, and test and packaging teams—experts who have helped customers bring some of the industry’s most complex and highest gate-count ASICs to market.