NXP and GLOBALFOUNDRIES Collaborate on 40nm Embedded Non-Volatile Memory Technology Development and Production

GLOBALFOUNDRIES and NXP announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform. GLOBALFOUNDRIES is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology.  Volume production is expected in 2016 at its Singapore facility.

Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology

GLOBALFOUNDRIES and SST announced the full qualification and availability of SST’s 55nm embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform. SST’s SuperFlash® Technology and GLOBALFOUNDRIES’ 55nm LPx provides low power and cost, high reliability, superior data retention and high-endurance performance customer solutions. The optimized and silicon-proven Flash IP blocks are available for various applications.

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Latest Updates from GLOBALFOUNDRIES

Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology (details)

 GLOBALFOUNDRIES will attend IMS 2015 in Phoenix (details)

CDNLive 2015 video interview on 14nm progress and collaboration (details)