NXP and GLOBALFOUNDRIES Collaborate on 40nm Embedded Non-Volatile Memory Technology Development and Production
GLOBALFOUNDRIES and NXP announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform. GLOBALFOUNDRIES is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology. Volume production is expected in 2016 at its Singapore facility.