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GLOBALFOUNDRIES mainstream technologies from 180nm to 40nm offer mixed-technology solutions on volume production-proven and industry-compatible processes.

GF MEMS technology is a production qualified suite of MEMS processes with CMOS integration. MEMS devices are available at volume production levels using our established 200mm CMOS manufacturing infrastructure. Customers can either customize their required solution from a flexible set of production-proven MEMS process modules or utilize a suite of ready to use MEMs reference designs on inertial sensors, energy harvesting and ultrasonic transducer based MEMs products. Built in close proximity to 200mm and 300mm CMOS manufacturing sites, a one-stop shop is available for both MEMS sensors / actuators and companion CMOS chips to simplify semiconductor sourcing.


  • AIN based Piezoelectric material for next generation MEMS devices
  • Class 1, CMOS-compatible MEMS cleanroom
  • Class 100/1000, dedicated MEMS cleanroom
  • Compliance to QA quality standards ISO/TS16949 requirements
  • Real-time SPC, equipment SPC and electronic quality systems
  • Collaborative development includes available turnkey packaging and testing services
  • Established MEMS manufacturing capabilities within a CMOS environment for MEMS micromachining, encapsulation, metrology and inspection

Targeted Applications

  • Accelerometers
  • Gyroscopes
  • Ultrasonic transducers
  • Timing and RF devices

MEMS and CMOS Integration Options

  • Traditional/SIP, WLP, WLP Smart Fusion, WLP Smart Fusion with TSV and WLP MEMS on CMOS

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