Embedded Memory

Production-ready, cost-effective memory solutions to address reliability and power challenges

GLOBALFOUNDRIES mainstream technology platforms from 180nm to 40nm include a wide variety of embedded memory solutions, including non-volatile 130nm and 55nm eFlash. The eFlash solutions, along with RF and analog enablement and comprehensive IP, support high performance, high reliability applications such as:

Embedded Memory Product Brief

  • High-reliability and AEC-Q100 automotive grade 1 MCUs
  • Industrial MCUs, IoT-gateways and smartcards
  • IoT, wearables, smart devices and sensor hubs
  • Integration of wireless connectivity with MCU (55nm LPx)
  • Integration of analog functions with MCU (130nm BCDLite®)
  • Other memory solutions include eFuse, EEPROM, OTP and MTP design-ready solutions with silicon validation


55nm eFlash Highlights

  • SST ESF3 3rd generation Super-Flash technology
  • Access speed: as fast as 10ns
  • Endurance: 200k cycles
  • Data Retention: 10 years at operation temperature (85°C commercial grade, 125°C automotive Grade 1 application)

Application Highlights

MCU/IoT

  • Cost effectiveness for consumer markets
  • High reliability and robustness for industrial markets
  • High operating temperature for Automotive Grade 1 (AEC Q100) products
  • Silicon-matched RF models for MCU with wireless connectivity
  • Ultra-low power solutions for IoT applications

Secure ID, RFID, Tag

  • More than 200k program/erase cycles on selected macros
  • "Common Criteria" EAL6 certified manufacturing site
  • Bankcard for highest security sites
Back to Top