Differentiated IP, design services, custom silicon and advanced packaging for end-to-end solutions

Avera Semi's application-specific integrated circuit (ASIC) solutions are designed to deliver system-level differentiation in semiconductors for next-generation wired/5G wireless networking, data center, machine learning, automotive and aerospace and defense applications. The ASIC offerings leverage continuous innovation and investment to offer a wide-ranging combination of benefits:

  • Leading-edge and proven process technologies
  • Rich IP portfolio, including high-speed SerDes (HSS), high-performance embedded TCAMs, ARM® cores and performance and density-optimized embedded SRAMs
  • Comprehensive design methodology
  • Future-ready packaging options
  • Extensive ASIC expertise with proven record of delivering record first-time-right hardware
  • Long-term collaborations with industry leaders on solutions that keep pace with evolving requirements

All Avera Semi ASIC design systems are complemented by a comprehensive design methodology that enables seamless integration of differentiating IP using industry-standard design tools and flows. Validated through multiple silicon-proven successes, the methodology is optimized to help you achieve first-time-right results in hardware and faster time to market.

The ASIC packaging portfolio capitalizes on the latest advances to help meet demanding design requirements. Packaging innovations available in the FX-14 and Cu-32 ASIC design systems include high-performance substrate build-up materials, system-in-package configurations and 2.5D/3D die stacking architectures.

Flexible ASIC business engagement models give you the ability to supplement in-house resources with the level of support you need from our experienced chip design, methodology, test and packaging teams—experts who have helped clients bring some of the industry’s most complex and highest gate-count ASICs to market.

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