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Differentiated IP, design services, custom silicon and advanced packaging for end-to-end solutions

GLOBALFOUNDRIES application-specific integrated circuit (ASIC) solutions are designed to deliver system-level differentiation in semiconductors for next-generation wired/5G wireless networking, data center, machine learning, automotive and aerospace and defense applications. The ASIC offerings leverage continuous innovation and investment to offer a wide-ranging combination of benefits:

  • Leading-edge and proven process technologies
  • Rich IP portfolio, including high-speed SerDes (HSS), high-performance embedded TCAMs, ARM® cores and performance and density-optimized embedded SRAMs
  • Comprehensive design methodology
  • Future-ready packaging options
  • Extensive ASIC expertise with proven record of delivering record first-time-right hardware
  • Long-term collaborations with industry leaders on solutions that keep pace with evolving requirements

The FX-7™ design system, the most recent addition to the GF ASIC portfolio, can help you unlock new levels of performance and power efficiency. The design system takes advantage of GLOBALFOUNDRIES leading-edge 7nm FinFET technology platform, 7LP. Compared to the GF 14LPP technology platform, 7LP can provide more than 40% better performance and more than 60% lower total power.

Designed to serve emerging vertical markets and applications, the FX-7 offering expands the reach of GF ASIC solutions and is optimized for the data-driven era. FX-7 solutions take advantage of the learning from the production-proven FX-14™ design system and extensive in-house ASIC expertise. FX-7 design system highlights include:

  • Enhanced HSS portfolio supporting key data rates for next-gen memory interfaces, higher-speed I/Os and advanced integration, featuring industry-leading 112G solutions and 60G solutions optimized for area, performance and power
  • Low power, ultra-dense and performance-tuned embedded memory solutions, including the industry’s fasted embedded networking TCAM
  • Dense and high-performance design libraries for design flexibility and trade-offs
  • Low, ultra-low and overdrive supply voltages for power/performance optimization

All GF ASIC design systems are complemented by a comprehensive design methodology that enables seamless integration of differentiating IP using industry-standard design tools and flows. Validated through multiple silicon-proven successes, the methodology is optimized to help you achieve first-time-right results in hardware and faster time to market.

The ASIC packaging portfolio capitalizes on the latest advances to help meet demanding design requirements. Packaging innovations available in the FX-7, FX-14 and Cu-32 ASIC design systems include high-performance substrate build-up materials, system-in-package configurations and 2.5D/3D die stacking architectures.

Flexible ASIC business engagement models give you the ability to supplement in-house resources with the level of support you need from our experienced chip design, methodology, test and packaging teams—experts who have helped customers bring some of the industry’s most complex and highest gate-count ASICs to market.

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