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GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications

Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system

Santa Clara, Calif., August 9, 2017 – GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs).


Optimizing ASIC Designs for SWaP (Microwave Journal)


IoT Brochure

The rise of IoT and the Cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping our way of life.


22FDX® Product Overview


GlobalFoundries Corporate Brochure



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