Third Party Press Releases
Collaborative partnership accelerates commercialization of in-package optical I/O for applications in artificial Intelligence, cloud architectures, aerospace and 5G communications.
eMemory announced its NeoFuse IP has been qualified on GF's 28HV platform, in response to the rising demand for OLED display applications.
The new solution provides significant improvements in power, area and cost compared to current offerings and is set to serve the ever-growing demand for artificial intelligence (AI) and compute app
Movellus’ fully synthesizable and quickly customizable PLLs/DLLs are available to GF customers around the world with the goal of further enabling their designs and ultimately reducing their time-to
CSEM announced today at the GF Global Technology Conference EMEA that it has released its Bluetooth Dual-Mode silicon IP on GF’s 22FDX platform for next generation of portable audio devices ...
Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) and AI Inference IP, architecture and software, today announced that its nnMAX™ AI Inference IP is in development on G
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today launched a new collaborative apprenticeship program to make it easier for companies to off
Schumer Says U.S. Must Maintain Its Global Leadership In Semiconductor Tech Innovation, And New Schumer-Authored Bill Means More Microelectronics Factories & Jobs In The U.S.A.
Infosys (NYSE: INFY), a global leader in next-generation digital services and consulting, has been selected by GLOBALFOUNDRIES® (GF®),
Synopsys, Inc. today announced that GLOBALFOUNDRIES® (GF®) has qualified Synopsys' IC Validator for its 22FDX® platform.
Researchers replace traditional electronic I/O with optical signaling interfaces to achieve major improvements in link reach and efficiency
MixComm’s Novel Architecture with GLOBALFOUNDRIES’ mmWave Features Delivers the Ideal Combination of Output Power, Energy Efficiency and Integration
Magnetoresistive Random Access Memory (MRAM) continues to scale for both eMRAM and discrete MRAM solutions
Anokiwave’s 2nd Generation of Ku and K/Ka band Silicon Beamformer ICs for SATCOM market are in Full Volume Production, with a Turnkey Solution in partnership with GLOBALFOUNDRIES.
QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low-power multicore voice-enabled system-on-chips (SoCs), embedded FPGA (eFPGA), intellectual property (IP), Internet of Things (IoT), an
Anokiwave, Inc., a leader in providing highly integrated IC solutions for mmW markets and a trusted choice of Tier-1 and -2 OEMs, announces the commercial high-volume availability of the industry’s
CMC Microsystems has signed an agreement with GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, that will provide access to GF’s advanced and specialized FinFET, RF SOI, FDX, SiGe, and
Ayar Labs is pleased to announce that it’s been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES research project.
Innosilicon, the world-class innovative fabless IP design and customized ASIC company, announced today that its comprehensive IP portfolio has been qualified on GLOBALFOUNDRIES® (GF®) 22FDX® platfo
VeriSilicon, a Silicon Platform as a Service (SiPaaS®) company, today announced its comprehensive FD-SOI Design IP Platform with more than 30 IPs based on GLOBALFOUNDRIES® (GF®) 22FDX® platform.
Innosilicon, the world-class innovative fabless IP design and customized ASIC company, announced today that its comprehensive IP portfolio has been qualified on GLOBALFOUNDRIES® (GF ®) 12nm Leadi
CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low
Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, today announced that it has received working first silicon of its validation chip for the EFLX 4K eFPGA
High-quality DesignWare Interface and Analog IP Optimized for High Performance and Low Power in AI, Cloud Computing, and Mobile SoCs
Efabless, a crowdsourcing design platform for custom silicon, today announced a joint relationship with GLOBALFOUNDRIES (GF) that will extend Efabless’ design platform, Chiplicity, to include selec
Sonnet Software, Inc.
Attopsemi's I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and com
Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of th
Xpeedic Technology, Inc.
Rambus Inc., a leading provider of semiconductor and IP products, today announced the availability of 32G Multi-protocol SerDes PHY on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) platform for high-volume,
eMemory today announced that its NeoMTP, Multiple-Times-Programmable embedded non-volatile memory (NVM) IP, has been qualified on GLOBALFOUNDRIES (GF) 130nm BCDLite® and BCD process technology plat
Attopsemi's I-fuse™ OTP provides ultra-low read voltage/current, ultra-low program voltage/current, small size and wide temperature to enable GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute fo
Attopsemi's I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for automotive and IoT applications.
Shanghai, China – November 1, 2018 – VeriSilicon Holdings Co., Ltd.
Netronome, a leader in high-performance intelligent networking solutions, today announced an
eMemory today announced that its one-time programmable (OTP) non-volatile memory IP, NeoFu
Dolphin Integration today announced the qualification of the first wave of Power Management IPs on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) process technology.
Mentor, a Siemens business, today announced it has qualified complete solutions from its Calibre® nmPlatform™, Analog FastSPICE™ (AFS)™ Platform, Eldo® Platform and Nitro-SoC place and route system
SUNNYVALE, Calif., Oct.
Northampton, United Kingdom, October 2, 2018 - IN2FAB announced the opening of a new North American office to support and expand its existing business.
Mountain View, Calif., September 24, 2018 – Addressing the US aerospace industry’s growing need for embedded field-programmable gate arrays (eFPGAs), Flex LogixÒ Technologies, Inc., announced today
Keysight Technologies, Inc.
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full-flow digital tool suite has achieved certification for the GLOBALFOUNDRIES (GF) 22FDX® process technology.
San Jose, Calif., May 15, 2018 — Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, today announced that it has joined GLOBALSOLUTIONS®, GF’s ecosystem of partners that provides services from conception to production. As an ecosystem partner, Presto will provide its post-silicon engineering and production turnkey solutions based upon GF’s technologies and services for customers across the globe.
Hannover, Germany, February 26, 2018 – Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GL
LISLE, Ill.--(BUSINESS WIRE)--Molex and INVECAS today announced a joint collaboration to develop an Automotive Infotainment Media Module for intelligent vehicles.
Reduced Energy Microsystems (REM) announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP available for GF’s 22FDX® process.
SiFive announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP including SiFive’s E31 and E51 RISC-V cores available on GF’s 22FDX® proce
Andes Technology Corporation (TWSE: 6533) and GLOBALFOUNDRIES (GF) today jointly announced that Andes’ 32-bit CPU IP cores have been implemented on GF’s 22nm FD-SOI (22FDX®) technology.
Menta today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program.
Dolphin has joined the GlobalFoundries FDXcelerator™ ecosystem with its breakthrough SoC Fabric IP, compliant with Dolphin Integration's "DELTA" rules, to streamline and speed-up the design of cost
Cadence Design Systems, Inc.
ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program.
sureCore Ltd., the Low Power SRAM IP leader, today announced it has joined the GLOBALFOUNDRIES (GF) FDXcelerator™ Partner Program and will make both their best-in-class Low Power “PowerMiser” and U
Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with GLOBALFOUNDRIES (GF) to develop DesignWare® IP.
Montpellier, France – September 19, 2017 – Menta today announced that its embedded FPGA (eFPGA) IP is fully qualified for GLOBALFOUNDRIES’ (GF) advanced 14nm FinFET and 32nm SOI process technologie
SAN JOSE, CALIF.
MOUNTAIN VIEW and SANTA CLARA, Calif., June 29, 2017 – AImotive (www.aimotive.com) today announced its much anticipated, AI-optimized hardware IP is available
eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology.
San Jose, Calif.
Cadence Design Systems, Inc.
Scotts Valley, California – May 25, 2017 – Perceptia Devices, Inc., a developer of innovative phase-locked loop (PLL) and timing technology, today announced that it has joined GLOBALFOUNDRIES’ FDXc
Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications.
SUNNYVALE, CA -- (Marketwired) -- 03/13/17 -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable
Advanced driver assistance system (ADAS) computer vision SoC developed for European THINGS2DO project with working first silicon fabricated on GLOBALFOUNDRIES’ 22nm
SUNNYVALE, Calif. – February 7, 2017 – Rambus Inc.
The 300 mm UltraCMOS® 12 Technology Platform Boasts a 25-Percent Improvement in RONCOFF Performance
WILSONVILLE, Ore., December 22, 2016—Mentor Graphics Corp. (NASDAQ: MENT) today announced that it has joined GLOBALFOUNDRIES FDXcelerator™ Partner Program.
SUNNYVALE, CA -- (Marketwired) -- 11/30/16-- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and programmable l
San Diego CA, 14 November, 2016: Anokiwave, Inc., an innovative company providing highly integrated IC solutions for mmWave markets and active antenna based solutions, today announ
Program Gives Synopsys Access to GLOBALFOUNDRIES FDX Portfolio and Provides Customers with Tools that Support the Differentiated Features of FD-SOI
Chandler, AZ, August 3, 2016.
SUNNYVALE, Calif.--(BUSINESS WIRE)--
CHANDLER, Ariz., July 12, 2016 — Microchip Technology Inc.
A*STAR IME’s collaborative partnership with industry will enable the development of cutting-edge industrial-grade sensors to heighten performance and achieve cost-effectiveness for MEMS devices
Cadence Design Systems, Inc.
CHANDLER, Ariz., July 12, 2016 — Microchip Technology Inc.
WILSONVILLE, Ore., November 9, 2015—Mentor Graphics Corp.
SANTA CLARA, CA – November 9, 2015 – ATopTech, a leader in next-generation physical design solutions, today announced their Aprisa™ and Apogee™ Place & Route tools are now enabled for the curre