Mar 24, 2015
Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform
Singapore and Santa Clara, Calif., March 24, 2015–
GF, a leading provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a leading semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GF's 40-nanometer (nm) process technology platform. GF is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology. Volume production is expected in 2016 at its Singapore facility.
The successful execution of joint development and technology production milestones will enable faster time to market of high density on-chip eNVM for innovative applications in a variety of products including identification, near-field-communication, healthcare, and microcontrollers. NXP will leverage GF's leading-edge semiconductor manufacturing capability to apply the overall technology to 40nm eNVM that will bring competitive value to end customers.
“We are pleased to see the co-developed 40nm-LP eNVM technology is ready for production in GF facility,” said Dr. Hai Wang, executive vice president of Technology and Operations at NXP Semiconductor. “GF is the first foundry that developed this process technology specifically targeting markets that require embedded non-volatile memory products. The successful release to production will enable NXP to further strengthen our market leadership in offering advanced solutions for secure and near field communication market segments.”
“We have a long-standing and close collaboration with NXP across other technology nodes. The successful joint development of eNVM gives us a boost in our confidence in the marketplace as we advance our 40nm technology leadership,” said KC Ang, SVP and GM for GF Singapore. “We look forward to having additional eNVM technology offerings for future market opportunities.”
GF's manufacturing site in Singapore is certified by the German Federal Office for Information Security (BSI) for secure IC products manufacturing. In 2012, the foundry received Common Criteria ISO 15408-EAL 6 certification and successfully received renewal in 2014. The company is also a two-time winner of NXP annual supplier award for best foundry services.
NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at www.nxp.com.
GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit http://www.globalfoundries.com.
GF, Asia Pacific & Japan