Mar 10, 2016
Co-design flow exploits the best of EDA design platforms to simplify RF design
Santa Clara, Calif., March 10, 2016 — GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.
GF's RF Silicon-on-Insulator (RF SOI) technologies offer significant performance, integration and area advantages in front-end RF solutions for mobile devices and RF chips for high-frequency, high-bandwidth wireless infrastructure applications. GF's most advanced RF SOI technology, 7SW SOI, is optimized for multi-band RF switching in next-generation smartphones and poised to drive innovation in Internet of Things (IoT) applications.
The challenges of high-frequency and large-signal design in these applications have increased the need for an interoperable co-design flow. Designed for use with Keysight Technologies’ Advanced Design System (ADS) EDA software, GF’s new 7SW SOI PDKs allow designers to edit their designs in ADS using a single Si2 OpenAccess database without any interference.
The RFIC interoperability simplifies the design process by enabling the user to work from a single design database in ADS. This allows the user to edit and simulate schematic designs created in ADS. The same is true for layout where, for example, a user can open an IC layout cell view in ADS, instantiate the cell within a package or module, and then run an electromagnetic simulation on the complete design to validate its overall system performance.
“After releasing the first co-design PDK for our 5PAe silicon germanium offering, we are now extending our coverage of ADS PDK to our most advanced RF SOI technology, 7SW SOI. Our 7SW platform, with superior LNA, switch devices, and trap-rich substrates, offer improved devices reception, interference rejection, and battery life for fewer dropped calls and longer talk time,” said Peter Rabbeni, senior director of RF product marketing and business development at GF. “Our RF SOI technology has gained significant industry traction for cellular front-end module applications, and the new RFIC interoperability feature will allow us to provide our 7SW customers additional design flexibility with a single PDK.”
“GF customers can now access ADS’ dedicated RF design flow tools based on an OpenAccess based silicon PDK,” said Volker Blaschke, Silicon RFIC product marketing manager, Keysight EEsof EDA. “The new interoperability feature facilitates the design process by using a single OpenAccess design data library, removing redundant steps of keeping the design across different EDA environments in sync.”
For more information on GF’s RF SOI solutions, contact your GF sales representative or go to www.globalfoundries.com.
GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit http://www.globalfoundries.com.