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12 Dec
2019
Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training
Shanghai, China, December 12, 2019 – In conjunction with the launch of Enflame’s CloudBlazer T10, Enflame Technology and GLOBALFOUNDRIES® (GF®) today...05 Nov
2019
GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications
Next generation high bandwidth memory solution based on GF’s most advanced FinFET platform aims to deliver capacity, speed and power for cloud based...30 Oct
2019
GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure Business
Appointment reinforces company’s commitment to deliver specialized application solutions to targeted market segments and enable clients’ data...28 Oct
2019
GLOBALFOUNDRIES and TSMC Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
GLOBALFOUNDRIES (GF) and TSMC today announced they are dismissing all litigation between them as well as those that involve any of their customers.10 Oct
2019
GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems
22FDX security solution aims to protect against physical tampering and attacks for cellular Internet of Things (IoT) devices10 Oct
2019
GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things
Record silicon results to be presented tomorrow at GTC 2019 in Munich, made possible by the adaptive body biasing capability on GF’s 22FDX® platform...10 Oct
2019
GLOBALFOUNDRIES Acquires Smartcom’s PDK Engineering Team to Expand Worldwide Design Enablement Capacity
Acquisition strengthens overall process design capabilities and expands the company’s footprint in Europe24 Sep
2019
GLOBALFOUNDRIES’ GlobalFoundries Technology Conference 2019 in Silicon Valley to Spotlight Specialized Solutions for Emerging Markets
A rich program of talks, panels and partner exhibits will provide 700+ attendees with insights and networking opportunities in 5G, artificial...24 Sep
2019
GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications
Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI...24 Sep
2019
Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions
IP providers further strengthen ability to serve clients’ automotive IP needs on GLOBALFOUNDRIES’ 22FDX® platform24 Sep
2019
GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
Enhanced transistor performance, greater RF-centric enablement and comprehensive turnkey testing/packaging services provide a truly differentiated...24 Sep
2019
GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy
New business segments and leadership appointments further position the company for long-term growth and value creation26 Aug
2019
GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
Injunctions seek to prevent unlawful importation of infringing Taiwanese semiconductors13 Aug
2019
Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement
Toppan Photomasks, Inc., a subsidiary of Tokyo-listed Toppan Printing Co., Ltd., and GLOBALFOUNDRIES (GF), the world’s leading specialty foundry,...07 Aug
2019
GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
Arm’s interconnect technology on GF’s 12LP process enables high performance and low latency, while increasing bandwidth for high core designs in AI,...18 Jun
2019
GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth
Move marks company’s first independent female board member, bringing decades of leadership in rapid-growth companies06 Jun
2019
GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center
Agreements secure high-volume 300mm wafer supply to support a broad range of customer applications across fast growing market segments03 Jun
2019
Analog Bits and GLOBALFOUNDRIES Deliver Differentiated Analog and Mixed Signal IP for High-Performance Mobile and Compute Applications
Analog Bits’ Analog and Mixed Signal IPs Including Various PLLs, PCIe Reference Clock, Sensors and Power Circuits w20 May
2019
Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse
Brings World-class ASIC IP and Development Capabilities for Wired and Wireless Applications22 Apr
2019
ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility
Acquisition optimizes cost structure, increases manufacturing capacity and positions both companies for future growth05 Mar
2019
MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts
Collaborative agreement expands existing relationship, to deliver requisite cost, scale and capacity to enable mainstream L-PIC deployment for 100G,...28 Feb
2019
Abu Dhabi Crown Prince Visits GLOBALFOUNDRIES Singapore Campus
Visit reinforces support for GF as the company executes on its new strategy21 Feb
2019
Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry’s First Automotive Grade 1 IP for 22FDX Process
Synopsys’ Portfolio of DesignWare Foundation, Analog, and Interface IP Accelerate ISO 26262 Qualification for ADAS, Powertrain, 5G, and Radar...20 Feb
2019
GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology
Mobile market continues to favor RF SOI, with 8SW proving to be the industry’s leading platform for power-optimized chips19 Feb
2019
GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration31 Jan
2019
VIS To Acquire GLOBALFOUNDRIES’ Fab 3E In Singapore
Hsinchu, Taiwan and Santa Clara, Calif. Jan.29 Nov
2018
GLOBALFOUNDRIES Announces Industry’s First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands
Industry’s most advanced high-speed SiGe technology now available on 300mm manufacturing line for terabit communications and automotive radar...12 Nov
2018
GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications
55nm LPx platform, with SST’s highly reliable embedded SuperFlash®, increases performanc31 Oct
2018
GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions
New company leverages unrivaled legacy of bringing complex ASICs to market. Solutions will focus on networking, datacenter, AI/ML and other high-...26 Oct
2018
GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
To re-focus JV on high-demand, differentiated technologies for the Chinese market in line with GF’s recently announced shift to its technology...11 Oct
2018
GLOBALFOUNDRIES Expands RFwave™ Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G
Increased support affirms RFwave™ Program’s vital role in RF design and faster deployment for applications in a new era of wireless devices and...25 Sep
2018
GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications
RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped25 Sep
2018
Imagination and GLOBALFOUNDRIES Collaborate to Deliver Ultra-Low-Power Connectivity Solutions for IoT Applications
Imagination brings Ensigma Ultra-Low-Power Connectivity IP to GLOBALFOUNDRIES’ 22FDX® process25 Sep
2018
GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow’s Intelligent Systems
Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications27 Aug
2018
GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings
Semiconductor manufacturer realigns leading-edge roadmap to meet client need and establishes wholly-owned subsidiary to design custom ASICs09 Jul
2018
GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
With 50 client designs and growing, 22FDX proves its value as a cost-effective solution for power-sensitive applications28 Jun
2018
GLOBALFOUNDRIES to Deliver Socionext’s Next Generation Graphics Controller for Advanced In-Vehicle Display Applications
55nm LPx platform, with SST’s highly reliable embedded SuperFlash®, enables enhanced features and security protection for remote display applications29 May
2018
GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications
Company’s versatile high voltage technology offers full complement of logic, analog and power devices23 May
2018
GLOBALFOUNDRIES Announces Industry’s Most Advanced Automotive-Qualified Production FD-SOI Process Technology
Manufacturing certification for security, reliability and robustness provides customers with performance and power efficiency for automotive...26 Apr
2018
Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars
Arbe Robotics’ proprietary chipset leverages GF’s 22FDX® technology to deliver industry’s first real-time 4D imaging radar for level 4 and 5...09 Apr
2018
GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany
GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC)...09 Apr
2018
GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany
Round Rock, Texas, Santa Clara, Calif., and Dresden, Germany, April 9, 2018 — GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc.20 Mar
2018
GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications
RFwave™ Partner Program expands the ecosystem and enables faster product deployment on GF’s RF technology platforms19 Mar
2018
GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York
GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York14 Mar
2018
GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity
Integrated photonics technologies enable improved bandwidth and energy efficiency for next-generation optical interconnects09 Mar
2018
Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES’ Sanjay Jha to Pass Baton to Industry Veteran Tom Caulfield
Santa Clara, Calif., March 9, 2018 – After more than four years as chief executive officer of GLOBALFOUNDRIES, Sanjay Jha will hand over the company’...27 Feb
2018
GLOBALFOUNDRIES Strengthens 22FDX® eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference Design
Co-developed technology solution enables significant power and die size reductions for IoT and wearable products24 Jan
2018
GLOBALFOUNDRIES Delivering 45nm RF SOI Customer Prototypes for 5G Applications
Company’s advanced 300mm RF SOI offering is ready for volume production09 Jan
2018
STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Leadership
GF’s FDX technology will enable ST to deliver high-performance, low-power products for next-generation consumer and industrial applications04 Dec
2017
GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications
Collaboration to push the limits of chip technology, extending optical circuits to meet rising demands in bandwidth and data center connectivity15 Nov
2017
GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions
High bandwidth, low power SerDes IP portfolio enables ‘connected intelligence’ in data centers and networking applications14 Nov
2017
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
GF’s 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China’s most advanced CPU bank card23 Oct
2017
GTC Shanghai Highlights GF’s Momentum in China
Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors12 Oct
2017
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected Car
AutoPro™ provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a new era of ‘connected...20 Sep
2017
GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications
Advanced 8SW 300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications20 Sep
2017
GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI20 Sep
2017
GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications
Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G20 Sep
2017
GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers
Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology20 Sep
2017
GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform
Technology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly...20 Sep
2017
GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI Platform
Advanced embedded non-volatile memory solution delivers ‘connected intelligence’ by expanding SoC capabilities on the 22nm process node20 Sep
2017
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications
New 12LP technology offers density and performance improvement over current generation18 Sep
2017
GLOBALFOUNDRIES Announces Enhanced RF SOI Process Design Kit For Use with CWS’ SiPEX™ Design Solution
Enhanced PDK incorporates design productivity tool to further enhance high-performance RF SOI switches09 Aug
2017
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system03 Aug
2017
GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles
Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, energy...13 Jul
2017
GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks
Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications19 Jun
2017
GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family
55nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health and...13 Jun
2017
GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology
New 7LP technology offers 40 percent performance boost over 14nm FinFET13 Jun
2017
GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks
FX-7TM offering leverages the company’s 7nm FinFET process to deliver best in class IP and Solutions23 May
2017
GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China
10 May
2017
Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology
Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program09 Mar
2017
InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology
UltraPrint technology expected to enable deployment of ultrasonic fingerprint solutions under glass as well as other solid surfaces21 Feb
2017
GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications
Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations09 Feb
2017
GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand
Company invests for capacity growth in the United States, Germany, China and Singapore15 Dec
2016
GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions
Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES FDX™ portfolio13 Dec
2016
GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology
Proven ASIC IP solution will enable significant performance and power efficiency improvements for next-generation high-speed applications24 Oct
2016
Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments
Collaboration with GLOBALFOUNDRIES to extend copper interconnects to 100G bandwidth lowering the cost of high-performance data center connectivity...29 Sep
2016
INVECAS to Enable ASIC Designs for Tomorrow’s Intelligent Systems on GLOBALFOUNDRIES FDX™ Technology
INVECAS to Collaborate with GLOBALFOUNDRIES to Provide IP and End-to-End ASIC Design Services on 22FDX® and 12FDX™ Technologies28 Sep
2016
INVECAS and GLOBALFOUNDRIES Announce Availability of Advanced 14nm FinFET Design IP Library for High-Performance Computing, Networking, and High-End Mobile Applications
Silicon-proven and optimized IP from INVECAS is now available for foundry customers on GLOBALFOUNDRIES 14LPP process15 Sep
2016
GLOBALFOUNDRIES to Deliver Industry’s Leading-Performance Offering of 7nm FinFET Technology
Company extends its leading-edge roadmap for products demanding the ultimate processing power15 Sep
2016
GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX® Platform
High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive08 Sep
2016
GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow’s Connected Systems
FDXcelerator™ Partner Program expands the ecosystem and promotes faster, broader deployment of GF’s FDX™ portfolio08 Sep
2016
GLOBALFOUNDRIES Extends FDX™ Roadmap with 12nm FD-SOI Technology
12FDX™ delivers full-node scaling, ultra-low power, and performance on demand25 Jul
2016
GLOBALFOUNDRIES Appoints Wallace Pai as General Manager to Oversee China Business Development
Seasoned leader brings experience driving business development at Motorola, Qualcomm, Samsung and Synaptics31 May
2016
GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing
Company plans new manufacturing facility and additional design capabilities to serve customers in China23 May
2016
GLOBALFOUNDRIES Releases Performance-Enhanced 130nm SiGe RF Technology to Advance Next Generation Wireless Network Communications
Optimized SiGe 8XP technology will enable low cost, high-performance mmWave 20 GHz products for a broad range of RF applications15 Mar
2016
GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices
New PAx offerings enable customers to exploit optimized balance of performance, integration, and cost to meet the demands of evolving mobile standards10 Mar
2016
GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software
Co-design flow exploits the best of EDA design platforms to simplify RF design03 Mar
2016
GLOBALFOUNDRIES Adds Alain Mutricy as Head of Product Management Group
Santa Clara, Calif., March 3, 2016 — GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced today that...09 Feb
2016
SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology
Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly01 Dec
2015
GLOBALFOUNDRIES Strengthens Presence in Asia through Regional Headquarter Status in Singapore
First regional headquarters office outside of United States19 Nov
2015
GLOBALFOUNDRIES Receives Quality Award from INOVA Semiconductors GmbH
SINGAPORE, November 19, 2015 – GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a...11 Nov
2015
GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process Technology
GLOBALFOUNDRIES FX-14™ delivers industry’s most complete ASIC offering for chip designers targeting cloud, data center, and communication applications05 Nov
2015
GLOBALFOUNDRIES Achieves 14nm FinFET Technology Success for Next-Generation AMD Products
Leading-edge foundry’s proven silicon technology poised to help enable significant performance and power efficiency improvements for AMD’s next-...05 Oct
2015
GLOBALFOUNDRIES Names Bami Bastani as Senior Vice President of its RF Business Unit
Santa Clara, Calif, October 5, 2015 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today appointed Bami...03 Sep
2015
GLOBALFOUNDRIES and Catena Partner to Provide Next-Generation RF Connectivity Solutions for Growing Wireless Markets
Catena Wi-Fi and Bluetooth RF technologies available on GLOBALFOUNDRIES 28nm Super Low Power Process technology03 Sep
2015
QEOS and GLOBALFOUNDRIES to Offer Industry’s First CMOS Platform for MillimeterWave Markets
GLOBALSOLUTIONSSM Partnership will enable next-generation wireless technologies for applications in IoT, 5G and automotive13 Jul
2015
GLOBALFOUNDRIES Launches Industry’s First 22nm FD-SOI Technology Platform
22FDX® offers the best combination of performance, power consumption and cost for IoT, mainstream mobile, RF connectivity, and networking01 Jul
2015
GLOBALFOUNDRIES Completes Acquisition of IBM Microelectronics Business
Transaction adds differentiating technologies, world-class technologists, and intellectual property29 Jun
2015
GLOBALFOUNDRIES Obtains U.S. Government Clearance for IBM Microelectronics Business Acquisition
Santa Clara, Calif., June 29 2015: GLOBALFOUNDRIES today announced the company has obtained clearance from the Committee on Foreign Investment in the...02 Jun
2015
GLOBALFOUNDRIES Solidifies 14nm FinFET Design Infrastructure for Next-Generation Chip Designs
In collaboration with design ecosystem partners, GLOBALFOUNDRIES provides digital design flows for customers designing on leading-edge technology20 May
2015
GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications
Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs05 May
2015
Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology
SST’s SuperFlash®Technology and GLOBALFOUNDRIES 55nm LPx provides low power and cost, high reliability, superior data retention and high-endurance...24 Mar
2015
NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology
Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform Singapore and Santa Clara, Calif., March 24, 2015–13 Mar
2015
GLOBALFOUNDRIES Launches New Coalition of Companies to Support FIRST® Robotics
New group raises $486,000 to sponsor local FIRST programs, including the 2015 New York Tech Valley FIRST® Robotics Competition27 Feb
2015
GLOBALFOUNDRIES Singapore Joins SgIS to Offer Scholarship To Undergraduate Students
To nurture aspiring future leaders and build sustainable talent pipeline to support Singapore’s key strategic growth sector17 Feb
2015
GLOBALFOUNDRIES Joins IMEC to Develop Innovative RF Solutions for Internet of Things Applications
Cooperation will focus on critical R&D for mobile and wireless sensor networks Santa Clara, Calif., February 17, 2015 –09 Jan
2015
GLOBALFOUNDRIES and Linear Dimensions to Offer Joint Analog Solution For Fast-Growing Wearables and MEMs Sensors Markets
CES 2015, Las Vegas, January 09, 2015 - GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, and Linear Dimensions...17 Dec
2014
GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process
GLOBALFOUNDRIES also tapes out second ARM Cortex-A17 processor using full Cadence digital implementation and signoff flow16 Dec
2014
GLOBALFOUNDRIES-Town of Malta Foundation Awards 2014 Grants
Foundation presents $172,915 in new funding to 43 local organizations supporting a wide variety of community programs06 Nov
2014
GLOBALFOUNDRIES and INVECAS Introduce New Dedicated Design Service Partner for Leading-Edge Technologies
INVECAS Inc. will provide design services to GLOBALFOUNDRIES customers designing on leading-edge processes27 Oct
2014
Everspin and GLOBALFOUNDRIES Partner to Supply Fully Processed 300mm CMOS Wafers with Everspin’s ST-MRAM Technology
Partnership with leading foundry will support Everspin’s ST-MRAM market growth starting with 40nm and 28nm technology20 Oct
2014
GLOBALFOUNDRIES TO ACQUIRE IBM'S MICROELECTRONICS BUSINESS
Acquisition Enables GLOBALFOUNDRIES to Become a World Leader in Semiconductor Foundry Technology;01 Oct
2014
Cisco Awards GLOBALFOUNDRIES 2014 Excellence in Silicon Ecosystems
Santa Clara, Calif., October 1, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that...09 Sep
2014
GLOBALFOUNDRIES and Semiconductor Research Corporation Announce New Scholarship for Undergraduate Engineering Students
New Scholarship Recognizes Rising Semiconductor Industry Talent08 Sep
2014
QuickLogic and GLOBALFOUNDRIES Collaborate to Deliver Next-Generation Sensor Hub for Smartphones and Wearables
ArcticLink® 3 S2 silicon platform to use 65nm process technologies04 Sep
2014
GLOBALFOUNDRIES Adds Louis Lupin as Chief Legal Officer
Santa Clara, Calif., September 4, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced07 Aug
2014
GLOBALFOUNDRIES Adds Bill Davidson as Chief Administrative Officer
CEO Sanjay Jha expands executive team to help lead next phase of growth19 Jun
2014
GLOBALFOUNDRIES Presents First Global Supplier Awards
JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership04 Jun
2014
Scaleo Chip and GLOBALFOUNDRIES Announce First Automotive MCU Manufactured Using 55nm Automotive-Specific Semiconductor Platform
Sophia Antipolis - France, Santa Clara - Calif, June 4, 2014: Scaleo chip today announced that they are the first fabless company to introduce an...14 May
2014
GLOBALFOUNDRIES Names Tom Caulfield as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York
Santa Clara, Calif., May 14, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today appoi07 May
2014
GLOBALFOUNDRIES Introduces 55nm Automotive-Specific Advanced Semiconductor Manufacturing Platform
55nm solution provides advanced technology and comprehensive design enablement support optimized to meet unique requirements of in-vehicle ICs21 Apr
2014
Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner
Partnership will enable FFSA and ASIC solutions on GLOBALFOUNDRIES technologies17 Apr
2014
Samsung and GLOBALFOUNDRIES Forge Strategic Collaboration to Deliver Multi-Sourced Offering of 14nm FinFET Semiconductor Technology
Shared technology allows global capacity for 14nm FinFET fabrication in the U.S. and Korea12 Mar
2014
Cadence and GLOBALFOUNDRIES Announce First Test Chip Featuring ARM Cortex-A12 Processor in 28nm-SLP Process
Highlights:26 Feb
2014
GLOBALFOUNDRIES and Fraunhofer IIS to Collaborate on EUROPRACTICE, Europe’s MPW Wafer Shuttle Program
New channel partner agreement focuses on 40nm and 28nm processes06 Jan
2014
GLOBALFOUNDRIES Announces New Chief Executive to Lead Next Phase of Growth
Sanjay Jha appointed by GLOBALFOUNDRIES Board to lead company26 Nov
2013
A*STAR Institute of Microelectronics, GLOBALFOUNDRIES Singapore & Masdar Institute Of Science and Technology to Establish R&D Twin Lab to Advance Mems Technologies for Key Industries
The MoU was signed at the 7th Abu Dhabi-Singapore Joint Forum 2013 in Singapore21 Nov
2013
GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies
Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project21 Nov
2013
Open-Silicon and GLOBALFOUNDRIES Demonstrate Custom 28nm SoC Using 2.5D Technology
Design features two 28nm ARM Cortex-A9 processors interfacing across a silicon interposer06 Sep
2013
GLOBALFOUNDRIES Opens New China Office in Shanghai to Strengthen Commitment to Local Market and Customers
A Significant Milestone of the Leading Foundry's Strategic Growth in China to Build A Closer Partner and Customer Relationship20 Aug
2013
National Supply Chain Network Initiative (NSNI) Launched at the Clinton Global Initiative
National collaboration announced to build a more robust US supply chain and build the nation's manufacturing base17 Jun
2013
Rockchip Launches New Tablet SoCs on GLOBALFOUNDRIES' 28nm HKMG Process Technology
RK3188 and RK3168 leverage 28nm technology to achieve GHz performance at ultra-low leakage03 Jun
2013
ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology
New ARM POP technology provides core-hardening acceleration for Cortex-A12 and Cortex-A7 processors30 May
2013
GLOBALFOUNDRIES Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with Comprehensive Production-Ready Design Flows
Jointly developed with leading EDA providers, flows address AMS challenges from specification to verification; complete flows for digital design for...30 May
2013
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology
Collaboration with leading EDA vendors supports complete range of steps required to create and verify advanced stacking implementations using TSV and...21 May
2013
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology
STT-MRAM offers enhanced performance and scalability for embedded and standalone applications06 May
2013
GLOBALFOUNDRIES Singapore General Manager KC Ang Appointed As SEMI Singapore RAB Chairman
Singapore, May 6, 2013 — KC Ang, Senior Vice President and General Manager of GLOBALFOUNDRIES Singapore, has been appointed to serve SEMI S29 Apr
2013
Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology
Neubiberg / Dresden, Germany and Singapore — April 29, 2013 — Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and GLOBALFOUNDRIES Inc.22 Apr
2013
GLOBALFOUNDRIES Names Shigeru Shimauchi as New Country Manager For Japan Sales Office
Milpitas, Calif., April 22, 2013 — GLOBALFOUNDRIES today announced that the appointment of a new country manager for its sales office03 Apr
2013
GLOBALFOUNDRIES Helps Host National Academy of Sciences Conference
GLOBALFOUNDRIES CEO Ajit Manocha welcomes national leaders with opening keynote for National Academy of Sciences Conference on "New York's...02 Apr
2013
GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology
Fab 8 in New York delivers functional 20nm silicon with Through-Silicon-Vias (TSVs)19 Feb
2013
GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility05 Feb
2013
GLOBALFOUNDRIES and Synopsys Partner To Provide Comprehensive Design Environment for Foundry's 14 nm-XM FinFET Offering
IP and design tool flows accelerate implementation of robust non-planar architecture for mobile products05 Feb
2013
GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process Technology
Companies to deliver silicon-proven complex IP blocks for advanced interface solutions05 Feb
2013
GLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh Technology
Partnership Will Enable GLOBALFOUNDRIES Customers to Realize SoCs with Class-Leading Performance and Power-Efficiency in 28nm through Cyclos Resonant...05 Feb
2013
GLOBALFOUNDRIES Details 14nm-XM FinFET Technology Performance, Power and Area Efficiency with a Dual-Core Cortex-A9 Processor Implementation
Company expects 14nm-XM to deliver more than twice the energy efficiency of 28nm-SLP at only half the chip area05 Feb
2013
GLOBALFOUNDRIES To Offer Adapteva's Processor IP For 28nm SoC Designs
Customers can leverage massively parallel multicore technology in SoCs for next-generation mobile devices15 Jan
2013
Alexie Lee Recognized with Women in Manufacturing STEP Award
Executive's leadership helping to improve the economy by expanding advanced technology and manufacturing capabilities in the U.S.09 Jan
2013
Nitero Demonstrates High-Speed 60GHz Wi-Fi Solution on GLOBALFOUNDRIES 65nm-LPe RF Technology
Advanced RF technologies provide cost-effective andlower-power SoC solutions for mobile market08 Jan
2013
GLOBALFOUNDRIES To Build R&D Facility in New York to Accelerate Advanced Manufacturing Technologies for Global Customers
Near-$2 billion dollar Technology Development Center (TDC) to strengthen global R&D ecosystem from mask to silicon to packagingNo Results