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Across the globe and billions of times a day, we rely on mobile devices. Achieving seamless, high-quality and high-speed wireless connectivity that links people, business and things while keeping pace with growing demands for access to data—all types, all the time, from anywhere—requires more innovation with each generation of device.

Our RF, power management and application / baseband processor technologies are enabling industry leaders to shape the mobile computing landscape and bring increasingly sophisticated mobile devices to market.


Market Overview

Mobile devices continue to be a solid growth engine for the semiconductor industry, with a “smarter” device mix, more data traffic demanding increasingly higher performance and greater RF complexity driving more RF content.

Mobile Market and Trends – Smartphones and IoT Units

The Differentiator

End-to-end Semiconductor Solutions for Mobility. All from One Company.

GF is uniquely positioned to help you take mobile computing and connectivity to new levels, offering an array of established and leading-edge silicon technologies optimized for integration, performance, value and processing power. We’re working closely with EDA partners and mobility leaders to develop solutions that stay ahead of growing complexity in today’s mobile devices, and drawing on our decades of RF expertise to develop the 5G-ready technologies you can leverage for continued differentiation tomorrow.


GF Solutions

The depth and breadth of the GF silicon portfolio enables you to choose the best fit for your application, with solutions ranging from leading-edge application and baseband processors to differentiated RF connectivity and power management.

GF Products - Mobile Tiers and Customer Traction

Client Applications

With billions of chips shipped to clients, GF delivers proven technologies that give leading mobile suppliers the power to shape their market. To ensure we’re ready with the solutions you need to differentiate in future applications, we’re proactively investing in our roadmap, capacity and capabilities.

GF Products - Mobile Tiers and Customer Traction



Application/Baseband Processors

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RF FEM, Transceivers & SoCs

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Analog Power

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Application/Baseband Processors
  • Application/Baseband Processors
  • RF FEM, Transceivers & SoCs
  • Analog Power
  • Application/Baseband Processors
  • RF FEM, Transceivers & SoCs
  • Analog Power

Leading-edge FinFET and FD-SOI process technologies deliver the transistor densities and low power consumption required for powerful application and baseband processors in premium and basic smartphones. 

CategorizationLowMidHigh to Premium AP
Process TechnologyUp to 28nm28nm14nm and lower
Screen Size4.5”5.7”5.7”
Screen Resolution720p1080p5K (or 2K 1080p 3D)
Cameras5MP; FHD @30fps video16MP; 2K @60fps video HEVC 8b16MP; 4K @30fps video HEVC 8b to 34MP; 4K @120fps video HEVC 8b/10bit
StorageEMMC 5 / NANDEMMC 5.1, UFS2.0UFS2.0
CoresOcta-core, 64bit, ARM®
Cortex®-A53 +
Octa-core, 64-bit, ARM® Cortex®-A53 / A72
GPU: ARM® Mali™-400 equivalent
Octa-core ARM® Cortex® -A73/A72
ChargingUSB quick charge – 15Whr in 2 hrsUSB quick charge – 15Whr in 2 hrsUSB PD – 15Whr in 2 hrs
Baseband Cellular (voice and data)3G / 4G LTE CA3G / 4G LTE CA4G LTE CATX
Memory Controller LPDDR4, DDR4L 


As a full-service semiconductor company with extensive RF expertise and a global presence, GF is able provide a unique array of silicon technologies you can build on to meet design performance, complexity and cost requirements in the volumes you need. Our RF front-end module (FEM), transceiver and SoC technology portfolio is complemented by comprehensive enablement, frequent MPW runs and expert technical support to help you get your solution to market faster.
ADC/DAC SolutionsADC/DAC Solutions


Industry leading RF SOI technologies for switch, LNA and integrated RF front-end module solutions

  • Strong industry demand, with more than 27 billion RF SOI chips shipped to customers
  • World class harmonic, linearity and insertion loss performance
  • Ongoing innovation with high Vt FETs, dual-oxide, trap rich and switch enhancements
  • Strong roadmap paves the way for 5G phased array and beamforming solutions
2.5D/3D Stacked Memories2.5D/3D Stacked Memories


SiGe technologies optimized for Wi-Fi and cellular power amplifiers, displacing GaAs

  • More than 4.4 billion SiGe PA chips shipped to customers
  • High PA gain and linearity
  • Low LNA noise figure
  • High resistivity substrate options
  • Through-silicon vias
Optical and Networking LinksOptical and Networking Links


Broad portfolio of technologies to implement highly integrated, high-performance RF with digital SoCs and standalone, power- or cost-optimized RF radio transceivers

  • High-quality RF modeling PDKs with digital PDKs that enable performance/cost trade-offs across a wide range of technology nodes
  • Mature technologies for low-cost RF transceivers and SoCs 
    • 65nm
    • 55nm with eNVM
    • 40nm with RF and mmWave enablement, eNVM coming
  • Mainstream and leading-edge technologies for high-performance RF transceivers and SoCs, with silicon-proven Wi-Fi, BTLE and GPS technology solutions
    • 28nm: low power, low cost
    • 22FDX®: lowest power, highest performance
    • 12FDX™: FinFET-like performance, coming soon

Mobile Power Subsystems

The GF technology portfolio includes an array of solutions optimized for mobile power-management applications. 

IoT Tiers and Customer Traction
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