Communications & Data Center

Communications & Data Center

GLOBALFOUNDRIES accelerates the transformation of the network infrastructure and rise of hyperscale data centers by collaborating with industry leaders to deliver high-value, highly optimized semiconductor technologies and services for system-level differentiation.

Semiconductor solutions for these markets are becoming increasingly challenging as companies pursue more demanding performance, area, integration and power-efficiency objectives. GF's technology and services portfolio is designed to help you find exactly the right combination for your applications.

Market Overview

IoT Semiconductor Value

The Differentiator

IoT Semiconductor Value

GF Products

Leading Edge FinFET Roadmap: Maximizing processing performance

IoT Tiers and Customer Traction

Customer Applications

Communication and Data Center Customer Traction

Solutions

Wireless Infrastructure

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Wired Infrastructure

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Data Center

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Wireless Infrastructure
  • Wireless Infrastructure
  • Wired Infrastructure
  • Data Center
  • Wireless Infrastructure
  • Wired Infrastructure
  • Data Center

The evolution of the wireless infrastructure, with 5G rollouts nearing reality, fuels the need for increasingly higher performance silicon and lower power solutions that take advantage of leading-edge technology process nodes and advanced packaging to meet system-level design objectives.

GF’s comprehensive technologies and services portfolio enables end-to-end solutions for next-generation mobile networks.

Wireless Technology Evolution

Fully Integrated Technologies

ADC/DAC Solutions

ADC/DAC Solutions

High bandwidth converters with maximum Giga sample rates and best in class Signal-to-Noise ratio

2.5D/3D Stacked Memories

2.5D/3D Stacked Memories

Optical and Networking Links

Optical and Networking Links

(SiPh with up to 56Gbps)

Targeted Solutions for 5G Wireless Basestations

Silicon Platforms

Silicon Platforms

Radio, baseband and backhaul silicon platforms

End to End Solutions

End to End Solutions

RF and ADC/DAC converters with end to end solutions

Basestation Radio/Switch/Baseband Chip Key Requirements

Key Metrics & IPRadioSwitchBaseband
Core Clock (LTE/5G)Up to 894MHzUp to 600MHzUp to 600MHz
Die Size100 - 250mm2100 - 300mm2200 – 400mm2
SerDes SpeedsVarious 10G/12.5G/28G support
On Chip MemorySRAM : 50Mb to 100Mb (Optional)
Chip Level Power10 -15W20 – 30W15 – 20W
Ext. Memory & IntegrationHBM2.0, up to 25G, DDR3/4 3.2G, SiPh
Packaging2.5D + SiPh Interposer, MCM, Laminate
Key IP CoresPCIe 3.0/4.0 x2
JESD204B/C: 12.5G /25G
CPRI 9.8G/12.5G/25 – 80ch max for switch
DDR3/4 up to 3.2G w/ 144bit wide
GigE/Interlaken – 10/25G/ch; BW max 400G+

RF SOI & SiGe

Application24 GHz77-86 GHz
LowMidHigh
Gateways, Switchers, RoutersSiGe PA: 5PAe, 1KW5PAe, 5PAx, 1K5PAxSiGe HP: 8HP, 8XP
Small Cells, Metro CellsSiGe PA: 5PAe, 1KW5PAe, 5PAx, 1K5PAxSiGe HP: 8HP, 8XP
7SW, 45RFSOI (mmWave)
Data center / Cloud Computing SiGe HP: 8HP, 8XP
SiGe Usage Guidelines7SW, 45RFSOI Usage Guidelines
High PA Output PowerLow to Medium Output Power
Low Power / high frequency operationLow Power / Low to Medium Frequency Operation
Low to Medium Digital IntegrationHigh Digital Integration
Simplified Impedance Matching / mmWave BEOLSimplified Impedance Matching / mmWave BEOL (45RFSOI)
High Breakdown VoltagesLow to Medium Breakdown Voltages
High Operating VoltagesLow to Medium Operating Voltages
Excellent Thermal StabilityLNA+Switch integration
Low NF; 1/f noise 

Massive growth in data traffic and in the numbers and types of connected devices is fueling new network architectures and topologies. GF offers leading-edge process technologies and targeted solutions for integrated, next-generation wired infrastructure hardware to help you keep pace with network evolution and rising access, bandwidth and capacity demands.

The Differentiator – Vertical Integration of Value

Targeted Applications and Solution in Wired Infrastructure Markets

From 10G to 25G to 100G/400G

From 10G/40G/100G to 400G/1TE

Connectivity from 10G to 25G to 100G/400G; Nx 100G to 1Tb Ethernet

Networking with Switches

Networking with Switches

Service provider networking with switches, routers and transport networking

Controller in Access

Controller in Access

PHY and controller in access and backhaul solutions

Insatiable Bandwidth Increasing the Data Line Rates

Wired Infrastructure Systems: 40G/100G 400G to 1Tb

wired-infra

Fully Integrated Technologies

High Performence Silicon

High Performance Silicon

High-performance and low-power silicon on leading-edge process nodes

Complete IP portfolio: 10G, 28G, 56G

Complete IP portfolio: 10G to 56G

High-speed SerDes and transceivers and best-in-class memory and TCAM compilers

2.5D Interposer, 3D memory stacking

2.5D Interposer, 3D memory stacking

Integration of multicore ARM® SoC and high-speed memory HBMs and HMCs

Optical and Networking Links

Optical and Networking Links

Advanced optical and networking links for 400Gb connectivity

Wired Packet Processing Chip Requirements

Key Metrics & IPMid RangeHigh End
Line Rate BW200G to 400Gbps400Gbps – 1Tbps
Core ClockUp to 800MHzUp to 1GHz
Die Size250 – 500mm2500 – 700mm2 SerDes speeds per Channel
SerDes Speeds per ChannelUp to 28G / 56GUp to 56G / 112G
On Chip Memory / TCAM CompilersSRAM : 200Mb to 1Gb TCAM: 1.5GHz 100Mb+ Configurable
Chip Level Power50 – 70W70 – 100W
Ext. Memory & IntegrationHBM2.0, HMC, DDR4 3.2G, SiPh
Packaging2.5D / 3D + SiPh Interposer, MCM, Laminate
Key IP CoresPCIe 3.0/4.0 x16 – 64 Channels
DDR3/4 up to 3.2G w/ 288bit wide
GigE & Interlaken – 10/25/40/50/100+, BW max 400G/600G+
56G Transceivers up to 166 ch+

Compute-intensive workloads, data storage over the cloud and switching applications running centrally are changing data center dynamics. These developments drive the need for larger computing clusters to handle processing, along with more memory bandwidth and high-speed interconnectivity between servers, storage and switches.

Data Centers: Key Technologies & Applications

Fully Integrated Technologies

High Performence Silicon

Performence

High-performance and low-power silicon on leading-edge process nodes

Complete IP portfolio: 10G, 28G, 56G

Best-in-Class IP

Performance and power-optimized TCAMs and differentiated 56Gbps SerDes, with a roadmap to 112Gbps

2.5D/3D Stacked Memories

2.5D/3D Stacked Memories

2.5D Interposer, 3D Memory Stacking High-speed memory HBMs and HMCs

Optical and Networking Links

Optical and Networking Links

High-performance SiGe technologies and silicon photonics roadmap for 56Gbps solutions

Target Solutions for Data Center

Server Computing Solutions

Server Computing Solutions

Scale-out and scale-up server computing solutions

Networking Switches

Networking Switches

Top-of-Rack (ToR) and networking switches

High Capacity Storage

High Capacity Storage

Storage controllers and high capacity memory integration

Server Chip Key Requirements

Key Metrics & IPMid RangeHigh End
ARM®v8 64bit SupportUp to 64 cores100+ Cores
Core Clock (SoC)Up to 2GHzUp to 3GHz+
Die Size250 - 400 sq mm400+ sq mm
SerDes SpeedsUp to 28G x32chUp to 56G → 112G
Cache Memory Density16 – 32MB32MB – 64MB
Chip Level Power40 – 70W70W – 100W
Ext. Memory & IntegrationHBM2.0, HMC 25G, DDR4 3.2G. SiPh
Packaging2.5D / 3D + SiPh Interposer, MCM, Laminate
Key IPPCIe 3.0/4.0 x16 – 64 Channels
DDR 3/4 3.2G, 4x72Ch
GigE – 10/25/50/100G
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