Post-fab Services
GLOBALFOUNDRIES offers comprehensive services that provide a quick, high-quality and cost-effective path to production for your design. Our post-fab services are part of an open, flexible and collaborative supply chain that enables you to get to market faster with differentiated technology and solutions, highlighted by:
- "A La Carte" or complete full turnkey manufacturing services ➞ faster time to market
- In-house bump and probe capabilities ➞ fast yield feedback
- Advanced packaging and test solutions ➞ differentiated end products
Post-fab services are part of a GF collaborative supply chain model that utilizes both in-house and partner expertise for 2D, 2.5D and 3D interconnect. OSAT (Outsourced Semiconductor Assembly and Test) and memory partners provide expert services that are tightly integrated into the overall manufacturing flow.
"A La Carte" or Complete Turnkey Manufacturing Services
GF manufacturing services are offered in "A La Carte" or complete turnkey options for faster time to market. You choose the flow that best fits the design and your company capabilities. This successful supply chain model is based upon:
- Collaborative model with more than 15 years of experience and success
- Assembly and test co-development with leading-edge OSATs
- Development and validation of design flow, rules and tool alignment with EDA, IP and design vendors at the front end
Turnkey manufacturing services include:
- Package design
- Package and supplier selection
- Custom tooling
- Pricing negotiation
- Quality/capacity/project management
- Operations management
- Supplier audit
Managed Turnkey Services
GF also provides a full global turnkey flow from wafer tape-out to delivery of fully tested, packaged products. Turnkey service advantages include:
- Single Purchase Order (PO) concept with a simplified billing system for the complete and customized silicon-to-package value chain
- Optimized cycle time from planned and aligned process milestones in the value chain
- Dedicated turnkey Operations, Engineering/New Process Development, Quality, Accounts and Planning teams ensure seamless integration, exceptional quality, competitive cost and on-time delivery
In-house Bump and Probe Capabilities
With internal bump and probe capabilities, GF provides the fast path to entitlement yields. Capabilities include:
- Bump
- High capacity – up to 60k/month
- Lead free and Cu pillar in production
- uBump in qualification
- Fast prototype cycle times
- Sort
- Wide array of test platforms (190 testers in production)
- Fully automated data transaction and handling
- In-house probe card maintenance and repair
Advanced Packaging and Test Solutions
GF advanced packaging and test solutions provide a direct path to power, performance, cost and form-factor optimized solutions. Capabilities include:
- Novel wafer-level fan-out solutions (HD-FO)
- Non-monolithic integrated solutions (2.5/3D)
- 2.5D silicon interposers
- High bandwidth memory
- Advanced memory integration with stacked memories
- Integrated on interposer, parallel interface
- Hybrid memory cube (standalone memory, serial interface)
- 3D TSV at advanced nodes
Advanced test development and capabilities include:
- RF, analog, embedded memory and mmWave applications
- Expertise in test insertion for complex 2.5D and 3D solutions
