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FDXcelerator Partner Program

FDXcelerator Partner Program

FDXcelerator™ is a partner ecosystem that facilitates 22FDX® system-on-chip (SoC) design and reduces time to market for customers. With GLOBALFOUNDRIES and FDXcelerator Partner solutions, you can build innovative 22FDX SoC solutions with faster migration to FD-SOI from bulk nodes such as 40nm and 28nm.

Mountain View, Calif., September 24, 2018 – Addressing the US aerospace industry’s growing need for embedded field-programmable gate arrays (eFPGAs), Flex LogixÒ Technologies, Inc., announced today that its EFLXÒ4K Logic and DSP eFPGA IP cores are now in design for the 14nm process on GLOBALFOUNDRIES’ wafer fabrication facility in Malta, New York. Boeing is the first company to license the EFLX4K eFPGA cores on GF’s advanced 14nm foundry process, which will also be available for commercial applications.

Each FDXcelerator partner commits to provide a set of specific resources, including:

  • Tools (EDA) - Ecosystem-specific modules that leverage differentiated FD-SOI body-bias features, built into industry leading design flows
  • Design elements (IP) - Complete library including Foundation IP, interfaces and complex IPs to enable foundry customers to start designs with validated IP elements
  • Platforms (ASIC) - Complete 22FDX ASIC offering
  • Reference solutions (system IP, reference designs) – System-level expertise in emerging application areas to speed time to market
  • Resources (design consultation, services) - Dedicated resources to support 22FDX technology
  • Product packaging and test (OSAT) solutions

FDXcelerator Solar system

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Client Solutions Marketplace

FDXcelerator is an open and collaborative program with a variety of partners who commit to build innovative 22FDX SoC solutions that take advantage of the broad adoption and growth of the FDX market, including:

  • Ultra-low-power PMU IP in 22FDX, 10+ PMU IPs provides more selection
  • IPs in other GF processes are available, including proven eNVM IP
  • Providers of advanced packaging, assembly and test development services
  • 22FDX platform support and baseline package qualifications. Package types anticipated to be qualified are:
    • Flip chip - Chip Scale Package (FcCSP)
    • Wafer level - Chip Scale Package, Fan Out- (WlCSP-FO)
    • Wire Bond
  • Analog Value Ltd. offers a family of dual ADC IPs in 22FDX process with resolution ranging from 12b to 16b and sample rate from 5Msps to 50Msps
  • The ADCs have very small area and power consumption
  • Andes provides power-efficient, small-footprint 32-bit and 64-bit soft CPU IP cores implemented on GF’s 22nm FD-SOI (22FDX) technology, especially well-suited for the IoT, edge computing and deep learning SoC design
  • Andes provides a comprehensive ecosystem, including the most mature support for RISC-V processor cores
  • ArterisIP interconnect IP accelerates timing closure for FDX-based designs, in applications from automotive ADAS and machine learning to small IoT processors
  • ArterisIP FDX-based offerings include the Ncore Cache Coherent Interconnect IP with Ncore Resilience Package, FlexNoC Interconnect IP with FlexNoC Resilience Package and PIANO Timing Closure Package
  • Providers of advanced packaging, assembly and test development services
  • 22FDX platform support and baseline package qualifications. Package types anticipated to be qualified are:
    • Flip chip - Chip Scale Package (FcCSP)
    • Wafer level - Chip Scale Package, Fan In - (WlCSP-FI)
    • Wafer level - Chip Scale Package, Fan Out - (WlCSP-FO)
  • Founded in 2010, Attopsemi Technology is dedicated to developing proprietary I-fuse™ OTP IP to all CMOS process technologies from 0.7um to 7nm and beyond.
  • I-fuse™ OTP provides small size, high reliability, low program voltage, low power and wide temperature range to enable harsh applications such as automotive, 3D IC, and IoT applications.
  • Body Bias floor planning via Genus design exploration
  • FDX-tailored support for Voltus and Tempus solutions
  • Catena is an IC design house providing wireless high performance RF/mixed signal IPs implemented in advanced technology nodes.
  • Example IPs are BTDM/LE, Zigbee, Wifi 11ac/11ax, GNSS/BEIDOU.
  • Leading provider of low-power certified IP solution for Wireless Connectivity standards (WiFi, Bluetooth, Thread, NB-IoT, GNSS etc.) for consumer and IoT applications
  • Offers efficient AI & Deep Learning Processor IPs for Imaging and Computer Vision Edge IoT & Automotive Applications
  • Offers a complete portfolio of configurable RISC-V based processor IP cores
  • Provides a comprehensive processor development platform with full software toolchain support
  • Dolphin Integration SoC Fabric IP streamlines and speeds-up the design of cost-effective low-power SoC in 22FDX® technology
  • Dolphin Integration 22FDX IP library includes power-saving voltage regulators, power gating cells and logic modules
  • Validated FDX design capabilities focused on differentiated Imaging and ADAS SoC realization
  • Complete System Enablement suite including design implementation, embedded software development, board and system design
  • Provides reliable OTP IP, NeoFuse, for sophisticated SoC designs on 22FDX process technology targeting mobile, IoT, and RF connectivity applications
  • Offers comprehensive, cost-effective, and customizable logic NVM solutions
  • Empyrean's high speed SarADC IP in 22FDX provides high performance with ultra low power
  • Empyrean's worldwide support team provides timely, strong support
  • Design services for Automotive, CCS, and RF
  • Value-add services include firmware development and pre/post silicon validation
  • Optimized eNVM and processor subsystems IP for non-volatile IoT SoCs
  • Advanced IP for efficient code and data management in ultra-low power designs
  • A leading applied research and development center for ASIC, system-on-chip (SoC), and IP
  • Offers dynamic biasing IPs for advanced SoC designs in 22FDX technology
  • OSAT provider to apply TSVs for CIS package in mass production
  • OSAT provider with CIS product turn-key services from chip package to module
  • Ensigma is a leader in delivering wireless connectivity and broadcast IP solutions
  • Provides a single-source solution for low-power connectivity including Wi-Fi, BLE and 802.15.4
  • Silicon-to-systems range of engineering services
  • Software services ranging from various firmware, embedded and applications-specific offerings
  • ID-Xplore™: a Fast Design and Migration tool for analog IPs
  • ID-Xplore™ provides full support for static and dynamic body biasing in FD-SOI technologies
  • Silicon Validated Foundation and Complex IP
  • Portfolio ranging from Foundry Certified Foundation IP to a complete ASIC solution
  • Industry-leading RapidIO IP in 22FDX
  • Strong local support provides professional service to customers
  • Credentialed FD-SOI expertise on system design, IC design, and fast prototyping
  • IoT, RF, and ADAS SoC realization focus
  • Provides embedded FPGA (eFPGA) IP in 22FDX® System-on-Chip (SoC) designs targeting a variety of applications, including automotive ADAS, vision processors and ISP
  • eFPGA IP is highly flexible — the number of logic blocks as well as the type and number of arithmetic and memory blocks are fully customizable
  • FDX-tailored Calibre™ solutions for timing and physical verification
  • Mentor ICD to support, floor planning, synthesis, place & route capabilities and Tessent™ suite to offer DFT flow support
  • Mobile Semiconductor offers leading edge SRAM, ROM and Register File compilers optimized for applications requiring ultra-low power, low leakage, or ultra-high performance
  • Mobile Semiconductor’s 22nm FD-SOI (22FDX) low leakage compilers provide retention currents in the nanoamp range with configurable clock rate from 50 MHz to 500 MHz to trade off leakage versus performance
  • High-quality VbyOne IP in 22FDX, more high-speed IPs, display IPs and analog IPs are portable to 22FDX
  • Strong support system and flexibility on IP customization
  • All-digital PLL IP and complementary design solutions for 22FDX
  • Custom IC design and physical implementation services for GF FD-SOI process technologies
  • BSIMProPlus™, ME-Pro™: industry’s leading modeling solution, SPICE model extraction, customization & QA, process platform evaluation & benchmark, for Bulk, FD-SOI, FinFET technologies
  • NanoSpice™, NanoSpice Giga™: new SPICE and FastSPICE simulators, fully leverage parallel computing power to achieve accurate, fast and economic circuit simulation & verifications for big FD-SOI & FinFET designs
  • Mass production proven ultra-low power embedded FPGA
  • Complete SW support for FPGA design and SoC integration in 22FDX
  • GF channel partner providing IP and design services for 22FDX process technology
  • "makeChip" design service platform provides an IT infrastructure with EDA tools and technology data setup
  • Cryptofirewall cores which complement security implementations
  • DPA counter measure solution offerings to enhance security measures
  • Offers low-power 64-bit RISC-V CPU IP cores available on 22FDX process technology
  • Industry leader in low-power, asynchronous design focused on embedded computer vision and artificial intelligence
  • Software solutions and processes for IoT, automotive and industrial and emerging device technologies
  • Offer turnkey solutions including hardware and software for complete SoC production
  • Provides RISC-V CPU IP including SiFive's E31 and E51 RISC-V cores available on GF's 22FDX process technology
  • Founded by the inventors of RISC-V and the first fabless provider of customized semiconductors based on the free and open instruction set architecture
  • Silicon Creations provides world-class PLLs, low power, high-performance SerDes and high-speed differential I/Os with IP in production from 10nm to 180nm and proven in 7nm
  • Silicon Creations' GLOBALFOUNDRIES 22nm FDX General purpose Fractional-N PLL is wide range, being able to generate any frequency between 25MHz and 5GHz with a precision of better than 0.01ppm
  • SmartSpice™ and Utmost IV™ – Simulation, optimization and characterization of spice models for analog FDX circuits
  • iPDK’s for FDX technology for Silvaco’s custom design flow
  • EPU™ Studio based on the Sonics ICE-GRAIN™ power architecture to support body-bias
  • Configurable on-chip network suite of offerings to support design of complex on-chip interconnects between cores
  • Best-in-class low power “PowerMiser” and ultra low voltage “EverOn” SRAM offerings available on GF’s 22nm FD-SOI (22FDX) process technology
  • sureCore's industry-leading, low power SRAM technology meets both challenging power budgets and manufacturability constraints posed by today’s visionary IoT, wearable and medical products
  • FDX-tailored Galaxy Design Platform solution includes seamless Body Bias support
  • Access to specialized FDX AEs in China
  • DDR Interface IP, based on 14 issued patents, provides the right power, performance, area and reliability for FDX™-based SoCs in portable applications
  • Wide range of “ideas2silicon” services that span design specification, RTL, logic design/verification, physical implementation, and manufacturing operations.
  • One-stop-shop turnkey solution
  • China-based, with complete FDX-tailored ASIC platform capability and services

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