FDXcelerator™ Partner Program

FDXcelerator™ Partner Program

FDXcelerator is a partner ecosystem that facilitates 22FDX® system-on-chip (SoC) design and reduces time to market for customers. With GLOBALFOUNDRIES and FDXcelerator Partner solutions, you can build innovative 22FDX SoC solutions with faster migration to FD-SOI from bulk nodes such as 40nm and 28nm.

Each FDXcelerator partner commits to provide a set of specific resources, including:

  • Tools (EDA) - Ecosystem-specific modules that leverage differentiated FD-SOI body-bias features, built into industry leading design flows
  • Design elements (IP) - Complete library including Foundation IP, interfaces and complex IPs to enable foundry customers to start designs with validated IP elements
  • Platforms (ASIC) - Complete 22FDX ASIC offering
  • Reference solutions (system IP, reference designs) – System-level expertise in emerging application areas to speed time to market
  • Resources (design consultation, services) - Dedicated resources to support 22FDX technology
  • Product packaging and test (OSAT) solutions

FDXcelerator Solar system

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Customer Solution Marketplace

FDXcelerator is an open and collaborative program with a variety of partners who commit to build innovative 22FDX SoC solutions that take advantage of the broad adoption and growth of the FDX market, including:

  • FDX-tailored Galaxy Design Platform solution includes seamless Body Bias support
  • Access to specialized FDX AEs in China
  • Body Bias floor planning via Genus design exploration
  • FDX-tailored support for Voltus and Tempus solutions
  • Silicon Validated Foundation and Complex IP
  • Portfolio ranging from Foundry Certified Foundation IP to a complete ASIC solution
  • One-stop-shop turnkey solution
  • China-based, with complete FDX-tailored ASIC platform capability and services
  • Credentialed FD-SOI expertise on system design, IC design, and fast prototyping
  • IoT, RF, and ADAS SoC realization focus
  • Design services for Automotive, CCS, and RF
  • Value-add services include firmware development and pre/post silicon validation
  • Validated FDX design capabilities focused on differentiated Imaging and ADAS SoC realization
  • Complete System Enablement suite including design implementation, embedded software development, board and system design
  • Mass production proven ultra-low power embedded FPGA
  • Complete SW support for FPGA design and SoC integration in 22FDX
  • Providers of advanced packaging, assembly and test development services
  • 22FDX platform support and baseline package qualifications. Package types anticipated to be qualified are:
    • Flip chip - Chip Scale Package (FcCSP)
    • Wafer level - Chip Scale Package, Fan In - (WlCSP-FI)
    • Wafer level - Chip Scale Package, Fan Out - (WlCSP-FO)
  • Providers of advanced packaging, assembly and test development services
  • 22FDX platform support and baseline package qualifications. Package types anticipated to be qualified are:
    • Flip chip - Chip Scale Package (FcCSP)
    • Wafer level - Chip Scale Package, Fan Out- (WlCSP-FO)
    • Wire Bond
  • Silicon-to-systems range of engineering services
  • Software services ranging from various firmware, embedded and applications-specific offerings
  • FDX-tailored Calibre™ solutions for timing and physical verification
  • Mentor ICD to support, floor planning, synthesis, place & route capabilities and Tessent™ suite to offer DFT flow support
  • Cryptofirewall cores which complement security implementations
  • DPA counter measure solution offerings to enhance security measures
  • Software solutions and processes for IoT, automotive and industrial and emerging device technologies
  • Offer turnkey solutions including hardware and software for complete SoC production
  • EPU™ Studio based on the Sonics ICE-GRAIN™ power architecture to support body-bias
  • Configurable on-chip network suite of offerings to support design of complex on-chip interconnects between cores
  • Founded in 2010, Attopsemi Technology is dedicated to developing proprietary I-fuse™ OTP IP to all CMOS process technologies from 0.7um to 7nm and beyond.
  • I-fuse™ OTP provides small size, high reliability, low program voltage, low power and wide temperature range to enable harsh applications such as automotive, 3D IC, and IoT applications.

 

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