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11月 19

2018

Attopsemi的I-fuseTM OTP采用格芯22nm FD-SOI工艺技术,在工作电压0.4V,功率1uW,可读取弗劳恩霍夫光子微系统研究所(IPMS)的61GHz RFID无电池标签

Attopsemi的I-fuse™ OTP提供超低的读取电压/电流和超低的编程电压/电流,尺寸小巧,温度范围广泛,支持格芯22nm FD-SOI工艺,可以读取弗劳恩霍夫光子微系统研究所(IPMS)的61GHz物联网应用RFID标签。
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11月 19

2018

Attopsemi的I-fuseTM OTP采用格芯的22FDX FD-SOI工艺技术,通过250℃/1000小时的晶圆级老化测试

Attopsemi的I-fuse™技术具有尺寸小巧、高可靠性、低电压/电流编程、功率低和温度范围广的特性,藉由格芯22nm FDX® 的支持与合作实现汽车和物联网应用。
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11月 01

2018

芯原微电子发布抄底功耗BLE 5.0基于格芯22FDX® FD-SOI工艺的射频IP,针对物联网应用

Shanghai, China – November 1, 2018 – VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI process.
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10月 31

2018

Netronome 发布针对先进SoC设计的开放Chiplet架构

Netronome, a leader in high-performance intelligent networking solutions, today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of...
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10月 17

2018

eMemory的OTP IP已在格芯22nm FD-SOI工艺上通过认证

eMemory today announced that its one-time programmable (OTP) non-volatile memory IP, NeoFuse, has been qualified on GLOBALFOUNDRIES (GF) 22FDX ® 22nm Fully-Depleted Silicon On-Insulator (FD-SOI)...
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10月 11

2018

功率调节IP现已在格芯22FDX®技术平台上通过芯片验证

Dolphin Integration today announced the qualification of the first wave of Power Management IPs on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) process technology. This consistent offering will help in...
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10月 09

2018

QuickLogic宣布ArcticPro eFPGA已在格芯22FDX®工艺上通过芯片验证

SUNNYVALE, Calif., Oct. 9, 2018 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice enabled SoCs, embedded FPGA (eFPGA) IP, display bridge and...
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10月 09

2018

Mentor发布优化流程,针对格芯22FDX IC制造工艺实现全新填充自动化

Mentor, a Siemens business, today announced it has qualified complete solutions from its Calibre® nmPlatform™, Analog FastSPICE™ (AFS)™ Platform, Eldo® Platform and Nitro-SoC place and route system...
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10月 02

2018

IN2FAB加入格芯FDXcelerator™合作伙伴计划

Northampton, United Kingdom, October 2, 2018 - IN2FAB announced the opening of a new North American office to support and expand its existing business. The centre will operate in conjunction with the...
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9月 25

2018

波音国防、空间和安全部门授权Flex Logix的嵌入式现场可编程门阵列采用格芯14nm工艺

Mountain View, Calif., September 24, 2018 – Addressing the US aerospace industry’s growing need for embedded field-programmable gate arrays (eFPGAs), Flex LogixÒ Technologies, Inc., announced today...
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9月 17

2018

Keysight Technologies的3D平面电磁仿真器经认证可用于格芯22FDX®工艺技术

Enables designers to perform accurate EM simulation with GF's cutting-edge 22FDX technology
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8月 30

2018

Cadence全流程数字工具套件获得格芯22FDX®认证

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full-flow digital tool suite has achieved certification for the GLOBALFOUNDRIES (GF) 22FDX® process technology. The GF...
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5月 15

2018

Presto Engineering加入格芯生态系统 成为格芯的新ASIC合作伙伴

San Jose, Calif., May 15, 2018 — Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, today announced that it has joined GLOBALSOLUTIONS®, GF’s...
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5月 14

2018

格芯认证Synopsys IC Validator用于核签物理验证

Synopsys, Inc. (Nasdaq: SNPS) today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys IC Validator tool for physical signoff on the GF 14LPP process technology. With this signoff...
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2月 27

2018

Dream Chip Technologies展示基于格芯22FDX®技术的使用在汽车驾驶辅助SoC的卓越电能效率

Hannover, Germany, February 26, 2018 – Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on...
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2月 20

2018

INVECAS和Molex在汽车信息娱乐媒体模块方面开展合作

 Molex and INVECAS today announced a joint collaboration to develop an Automotive Infotainment Media Module for intelligent vehicles. 
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12月 05

2017

Reduced Energy Microsystems加入FDXcelerator项目,将RISC-V IP引入格芯的22FDX®工艺技术

Reduced Energy Microsystems (REM) announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP available for GF’s 22FDX® process. 
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11月 28

2017

SiFive加入FDXcelerator™项目,将RISC-V核心IP引入格芯的22FDX®工艺技术

SiFive announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP including SiFive’s E31 and E51 RISC-V cores available on GF’s 22FDX® ...
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10月 24

2017

Andes 32位CPU IP内核使用格芯22FDX®工艺技术

Andes Technology Corporation (TWSE: 6533) and GLOBALFOUNDRIES (GF) today jointly announced that Andes’ 32-bit CPU IP cores have been implemented on GF’s 22nm FD-SOI (22FDX®) technology. 
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10月 23

2017

Menta加入格芯的FDXcelerator合作伙伴项目

Menta today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. 
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10月 16

2017

Dolphin Integration加入格芯FDXcelerator™计划以提供突破性的Fabric IP

Dolphin has joined the GlobalFoundries FDXcelerator™ ecosystem with its breakthrough SoC Fabric IP, compliant with Dolphin Integration's "DELTA" rules, to streamline and speed-up the design of cost-...
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10月 12

2017

Rambus在面向数据中心和企业的格芯 FX-14™ASIC平台上推出高速SerDes接口解决方案

Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G ...
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10月 12

2017

Cadence宣布格芯22FDX™工艺技术的数字签名流程支持Body-Bias Interpolation

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES...
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10月 10

2017

ArterisIP 加入格芯FDXcelerator合作伙伴项目

ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program....
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10月 09

2017

sureCore加入格芯FDXcelerator™合作伙伴项目

sureCore Ltd., the Low Power SRAM IP leader, today announced it has joined the GLOBALFOUNDRIES (GF) FDXcelerator™ Partner Program and will make both their best-in-class Low Power “PowerMiser” and
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9月 20

2017

Synopsys和格芯合作开发用于22FDX®工艺的DesignWare IP

Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with GLOBALFOUNDRIES (GF) to develop DesignWare® IP.
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9月 20

2017

Synopsys设计平台获得格芯的22FDX工艺技术认证

Synopsys, Inc. (Nasdaq: SNPS) today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys Design Platform for the GF 22nm FD-SOI (22FDX™) process, ensuring designers achieve optimized...
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9月 19

2017

来自Menta的嵌入式FPGA获得格芯先进的14纳米FinFET和32纳米SOI工艺技术认证

Embedded FPGAs from Menta qualified for GLOBALFOUNDRIES’® Advanced 14nm FinFET and 32nm SOI Process Technologies eFPGAs enable built-in programmability in SoCs targeting defense, aerospace, ADAS, IoT...
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7月 11

2017

Uniquify 加入FDXcelerator计划,向格芯22FDX®技术平台提供DDR内存 IP

SAN JOSE, CALIF. –– July 11, 2017 –– Uniquify, a leading system-on-chip (SoC) fabless manufacturer and DDR memory system intellectual property (IP) provider, today announced that it has joined...
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7月 11

2017

Almotive发布 aiWare: 首创人工智能优化的无人驾驶硬件加速器

MOUNTAIN VIEW and SANTA CLARA, Calif., June 29, 2017 – AImotive (www.aimotive.com) today announced its much anticipated, AI-optimized hardware IP is available to global chip manufacturers for license...
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6月 29

2017

eVaderis加入FDXcelerator™项目,为格芯22FDX®技术平台提供内存IP

eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology. The advanced memory IP...
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6月 26

2017

ICE-P3 能量处理单元(EPU)集成了温度补偿的电压与频率控制,追求最大节能效果

San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s...
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6月 20

2017

Cadence为格芯7LP制程节点启用了定制/模拟和全流量数字工具

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP...
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6月 20

2017

Synopsys和格芯达成合作 为7nm FinFET制程提供设计平台和IP实现

Synopsys, Inc. (Nasdaq: SNPS) today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process...
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5月 25

2017

Perceptia加入格芯的FDXcelerator™项目,将PLL技术带入便携式设备

Scotts Valley, California – May 25, 2017 – Perceptia Devices, Inc., a developer of innovative phase-locked loop (PLL) and timing technology, today announced that it has joined GLOBALFOUNDRIES’...
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4月 27

2017

Fraunhofer IIS加入格芯的 FDXcelerator™项目程序以实现动态偏置IP

Erlangen, Germany: The Fraunhofer Institute for Integrated Circuits IIS, a leading applied research and development center for ASIC, system-on-chip (SoC), and IP, today announced that it will offer...
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3月 27

2017

ATTOPSEMI加入了FDXcelerator计划来提供高级非易失性存储器IP给格芯的22FDX®技术平台

SANTA CLARA, CA--(Marketwired - March 27, 2017) - ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator™ Partner Program, to provide a scalable, non-...
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3月 13

2017

QuickLogic 发布用于评估 ArcticPro eFPGA IP 的Aurora软件

SUNNYVALE, CA -- (Marketwired) -- 03/13/17 -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display...
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2月 27

2017

Dream Chip Technologies公司展示了其首个应用了22nm FD-SOI硅芯片的汽车辅助驾驶系统SoC

Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile...
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2月 07

2017

Rambus公司在格芯FX-14™ASIC平台上使用14nm LPP制程技术推出高带宽内存PHY

SUNNYVALE, Calif. – February 7, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-...
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1月 25

2017

Peregrine Semiconductor公司推出具有业界最佳RonCoff性能的下一代技术平台

SAN DIEGO – Jan. 25, 2017 – Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS® 12 technology platform. Now in...
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1月 25

2017

Sonics与格芯合作使得SoC设计师的利用22FDX®制程提升进行功耗和性能表现

San Jose, Calif. – January 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will...
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12月 23

2016

Mentor Graphics公司加入格芯FDXcelerator合作伙伴计划

WILSONVILLE, Ore., December 22, 2016—Mentor Graphics Corp. (NASDAQ: MENT) today announced that it has joined GLOBALFOUNDRIES' FDXcelerator™ Partner Program. FDXcelerator program partners support...
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11月 30

2016

QuickLogic公司加入格芯的FDXcelerator(TM)合作伙伴计划

SUNNYVALE, CA -- (Marketwired) -- 11/30/16 -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and...
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11月 14

2016

Anokiwave公司利用格芯的高性能SiGe技术为下一代无线市场开发毫米波产品

San Diego CA, 14 November, 2016:  Anokiwave, Inc., an innovative company providing highly integrated IC solutions for mmWave markets and active antenna based solutions, today announced a...
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9月 09

2016

Synopsys公司加入格芯的FDXcelerator合作伙伴计划,以实现使用FD-SOI过程的创新设计

MOUNTAIN VIEW, Calif. and SANTA CLARA, Calif., Sept. 8, 2016 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) and GLOBALFOUNDRIES today announced that Synopsys has joined the foundry...
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8月 03

2016

Everspin的256兆ST-MRAM磁阻随机读写内存以及MTJ垂直磁通道结点采样

August 3, 2016 Chandler, AZ, August 3, 2016.  Everspin Technologies strengthens its leadership position in ST-MRAM by sampling the world’s first product using perpendicular magnetic tunnel...
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7月 26

2016

Rambus宣布在格芯14nm LPP制程中使用经过硅验证的R + DDR4 PHY中,来服务于网络和数据中心的应用

July 26, 2016 04:30 PM Eastern Daylight TimeSUNNYVALE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ:RMBS) today announced that it has developed an R+ DDR4 PHY on the GLOBALFOUNDRIES FX-14™...
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7月 12

2016

SST宣布在格芯的BCDLite®制程上的嵌入式SuperFlash®资质

CHANDLER, Ariz., July 12, 2016 — Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon...
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6月 08

2016

针对工业物联网、汽车自动化和户内导航应用,A*STAR IME将加强MEMS技术的能力。

A*STAR IME’s collaborative partnership with industry will enable the development of cutting-edge industrial-grade sensors to heighten performance and achieve cost-effectiveness for MEMS devices 
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2月 02

2016

新的Cadence Modus测试解决方案可以降低高达3倍的SoC测试时间

SAN JOSE, Calif., 01 Feb 2016Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Modus™ Test Solution that enables design engineers to achieve an up to 3X reduction in test time,...
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