Value-Added Solutions
GLOBALFOUNDRIES' Value-Added Solutions (VAS) are comprised of modules built on production-proven baseline technologies, structured into application-specific platforms that provide customers a faster time-to-market.
VAS offers innovative and complete solutions that enable customers to differentiate and win in the dynamic consumer and communication markets. By adopting an application-specific platform approach; on which multiple modules can be "bolted on", the VAS platform can be enhanced with additional features, like programmability, or expand further to address new markets. Modular technologies like RF CMOS, High Voltage (HV) and Non-Volatile memories (NVM) can be "mixed-and-matched," resulting in additional flexibility and faster response to market changes.
Figure 1. Several VAS modules can be integrated easily to create a differentiated design to address various consumer and communication markets.
Figure 2. A comprehensive VAS roadmap at multiple technology nodes
Furthermore, innovative new products can be developed. This is all done without changes to the core technology's IP and design enablement. Together with GLOBALFOUNDRIES extensive deployment of the VAS modules on multiple technology nodes, the innovations can be extended for better performance at competitive cost.
GLOBALFOUNDRIES VAS focuses on enabling customers' differentiation of their products in existing and new markets, while ensuring shortest time-to-market and minimal cost of ownership. Since VAS' inception in 2002, multiple solutions have been launched to address needs in display drivers, ID and smart cards, Wi-Fi, Bluetooth applications, and power management.
In 2004, GLOBALFOUNDRIES (previously Chartered) was the first pure-play foundry to introduce a mobile platform in 0.18um node; namely 0.18um Ultra Low Leakage (ULL) solution, to address the mobile display IC market. By 2010, this platform has been re-deployed to address green initiatives requirements for both mobile and non-mobile devices, proven in tens of thousands of wafers shipped every month. Nowadays, emerging MEMS and LED driver IC market are being enabled by the same platform.
Figure 3. Continuous innovations in Value Added Solutions.
|
|
|