Ideal platform for mixed-signal, RF, IoT and automotive applications
GLOBALFOUNDRIES mainstream platforms from 180nm to 40nm offer mixed-technology solutions on volume production-proven, industry-compatible processes.
The 55LPx platform is ideal for mixed-signal, RF, IoT and automotive applications with flexible mixed-technology options for logic, RF, eFlash/BCDlite®, ULP and automotive offerings based on a single model. They are design-ready solutions with process design kits (PDK) and silicon-validated IP from GLOBALFOUNDRIES and leading EDA and IP partners.
- Best in class D0: < 0.04 def/in2/layer defect density
- Applications in mass production
- RF transceivers, mobile TV
- Display drivers, TCON
- Bluetooth, Wi-Fi, access networks, GPS
- Digital TV, projectors
- 55LPx is the only 55nm platform to offer RF, eFlash/BCDlite, ULP and automotive solutions
- RF CMOS: Comprehensive design kit including silicon-validated models
- eFlash: Market-leading option with CC EAL6 Manufacturing-site Security Accreditation
- Automotive: AECQ-100 (Rev G) Grade 1 qualified process, eFlash and foundation IPs, ISO/TS16949 Quality Management System for Automotive
- High voltage: BCDlite isolated low Rdson 5V, 8V and 12V solutions
- ULP: SLVT and SHVT devices, true 0.9V SRAM solution, 0.9V IPs