Ideal platforms for analog, power, mixed-signal and RF applications 

130-180nm-mainstreamGLOBALFOUNDRIES mainstream platforms from 180nm to 40nm offer mixed-technology solutions on volume production-proven, industry-compatible processes.

The 130/180nm platforms are ideal for analog, power, mixed-signal and RF applications with flexible mixed-technology options for BCDlite®/BCD, high voltage and RF/mixed-signal. Available technologies include logic, analog/mixed-signal, RF, high voltage/power and eFlash/OTP/MTP memory. They are design-ready solutions with silicon-validated IP and process design kits (PDK) from GLOBALFOUNDRIES and leading EDA and IP partners.


Best In Class D0

Target applications 

  • Power, battery management, power over ethernet (POE), audio amplifiers, microcontrollers
  • AC-DC converters, LED lighting, motor drivers
  • Wireless transceivers, RF front end modules

BCDlite® a GLOBALFOUNDRIES innovation

  • Similar to BCD but with a simpler, more efficient and cost-effective process
  • No buried layer, sinker, deep trench isolation, in-process EPI
  • Ideal for applications up to 65V
  • Used in PMICs and audio amplifiers for leading mobile phones/tablets

Other modular platform options

  • eFlash: Market-leading option with low mask adder
  • Automotive: AECQ-100 (Rev G) qualified process, ISO/TS16949 Quality Management System for Automotive
  • Low Rdson and Low TCR resistor

180nm MCU Platform

  • Cost-effective process with very low mask count
  • Full IP solutions, SRAM, eFuse, OTP, MTP
  • 3.3V and 5V supplies, ideal for consumer MCU and analog/power applications
  • Roadmap to 153nm shrink

IP Eco System Extended IP offerings through Enabled IP Partner Program