Post-Fab Services

GLOBALFOUNDRIES offers comprehensive services that provide a quick, high-quality and cost-effective path to production for your design. Our post-fab services are part of an open, flexible and collaborative supply chain that enable you to get to market faster with differentiated technology and solutions, highlighted by:

  • "a la carte" or complete full turnkey manufacturing services ➞ faster time to market
  • In-house bump and probe capabilities ➞ fast yield feedback
  • Advanced packaging and test solutions ➞ differentiated end products

Post-fab Services are part of GLOBALFOUNDRIES collaborative supply chain model that utilizes both in-house and partner expertise for 2D, 2.5D and 3D interconnect. OSAT (Outsourced Semiconductor Assembly and Test) and memory partners provide expert services that are tightly integrated into the overall manufacturing flow shown in Figure 1.

Full Spectrum of Post-fab Services

Figure 1. Full Spectrum of Post-fab Services

"a la carte" or Complete Turnkey Manufacturing Services

GLOBALFOUNDRIES manufacturing services are offered in "a la carte" or complete turnkey options for faster time-to-market. You choose the flow that best fits the design and your company capabilities. This successful supply chain model is based upon:

  • Collaborative model with more than 15 years of experience and success
  • Assembly and test co-development with leading-edge OSATs
  • Development and validation of design flow, rules and tool alignment with EDA, IP and design vendors at the front end

Turnkey manufacturing services include:

  • Package design
  • Package and supplier selection
  • Custom tooling
  • Pricing negotiation
  • Quality/capacity/project management
  • Operations management
  • Supplier audit

Managed Turnkey Services

GLOBALFOUNDRIES also provides a full global turnkey flow from wafer tape-out to delivery of fully tested, packaged products. Turnkey service advantages include:

  • Single Purchase Order (PO) concept with a simplified billing system for the complete and customized silicon-to-package value chain
  • Optimized cycle time from planned and aligned process milestones in the value chain
  • Dedicated turnkey Operations, Engineering/New Process Development, Quality, Accounts and Planning teams ensure seamless integration, exceptional quality, competitive cost and on-time delivery

In-house bump and probe capabilities

With internal bump and probe capabilities, GLOBALFOUNDRIES provides the fastest path to entitlement yields. Capabilities include:

bump and sort
  • Bump
    • High capacity – up to 60k/month
    • Lead free and Cu pillar in production
    • uBump in qualification
    • Best-in-class prototype cycle times
  • Sort
    • Wide array of test platforms (190 testers in production)
    • Fully automated data transaction and handling
    • In-house probe card maintenance and repair

Advanced packaging and test solutions

GLOBALFOUNDRIES advanced packaging and test solutions provide a direct path to power, performance, cost and form-factor optimized solutions. Capabilities include:

  • Novel wafer-level fan-out solutions (HD-FO)
  • Non-monolithic integrated solutions (2.5/3D)
    • 2.5D silicon interposers
    • High bandwidth memory
      • advanced memory integration with stacked memories
      • integrated on interposer, parallel interface
      • hybrid memory cube (standalone memory, serial interface)
    • 3D TSV at advanced nodes

Advanced test development and capabilities include:

  • World-class RF, analog, embedded memory and mmWave applications
  • Expertise in test insertion for complex 2.5D and 3D products