GLOBALFOUNDRIES Announces Winners of Inaugural "Leading in Innovation" AwardsAt GTC 2011, customers recognized for product innovation utilizing foundry solutions Milpitas, Calif. – August 30, 2011 – At today’s second annual Global Technology Conference (GTC 2011), GLOBALFOUNDRIES announced the winners of its new “Leading in Innovation” awards. Presented to customers who have demonstrated innovative solutions on products ranging from 0.35um non-volatile memories to leading-edge 28nm smartphone processors, the awards showcase the company’s collaborative approach to enabling chip designers to deliver a superior end-user experience. “These awards epitomize the GTC 2011 theme of driving product innovation through true collaboration,” said Jim Kupec, senior vice president of sales and marketing at GLOBALFOUNDRIES. “We serve nearly all leading foundry customers in the world, and today it is a privilege to recognize this group of innovators with our ‘Leading in Innovation’ awards. These awards demonstrate the breadth of our 300mm and 200mm technology offerings, as well as our flexible regionalized service and differentiated design enablement support in collaboration with our ecosystem partners.” The 2011 “Leading in Innovation” award winners are:
“We are delighted to be recognized as an innovation leader by GLOBALFOUNDRIES,” said Remy De Tonnac, chief executive officer of INSIDE Secure. “INSIDE has built a strong working relationship with GLOBALFOUNDRIES for more than 10 years and has introduced several generations of innovative products with them. We work closely together on IP and technology development. Our leading MicroRead NFC product line is poised for volume production in 0.35um at GLOBALFOUNDRIES’ Fab 2 in Singapore.” “The superior performance and analog headroom provided by the GLOBALFOUNDIRES 28nm-SLP process makes it an ideal platform for SoC developers to target a wide variety of applications that require both low power and high performance operating characteristics,” said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. “The process itself provides significant advantages over previous process generations. On top of that, the implementation support available from GLOBALFOUDNRIES enables its customers to take full advantage of its capabilities in a highly efficient way. The design kits go way beyond a typical foundry PDK. Rambus is proof that a talented analog/RF design team can engineer some truly unique solutions at GLOBALFOUNDRIES.” “We know GLOBALFOUNDRIES well, both as a partner in technology development through ISDA, International Semiconductor Development Alliance, and as one of our own trusted foundry partners,” said Jean-Marc Chery, Chief Technology Officer of STMicroelectronics. “The 28 nm technology portfolio from GLOBALFOUNDRIES is well-suited to manufacture the ST-Ericsson 9600 platform, enabling multi source wafer fabs for ST and ST-Ericsson platforms at the 28nm node. Over several years, ST has built an excellent working relationship with GLOBALFOUNDRIES. ST sources a wide variety of 200mm and 300mm wafer products from GLOBALFOUNDRIES, from 0.5um EEPROM for the automotive industry to leading edge application processors for wireless and we’ve found GLOBALFOUNDRIES to be an innovative, reliable and cost-effective partner, effectively complementing our strong internal manufacturing machine, and we look forward to continuing our successful relationship with them.” “We utilize the 0.13um and 65nm low power RF technologies at GLOBALFOUNDRIES for our Lightwire LWS1040-LC 10 Gbps Small Form-factor Pluggable (SFP+) Extended Reach (ER) transceiver module,” said Kal Shastri, founder and chief technology officer of Lightwire. “We utilized the GLOBALFOUNDRIES RF PDKs for these products and found the models to be accurate and well characterized. We have worked with GLOBALFOUNDRIES from the very beginning of our company, as a new start-up, and always received excellent attention and support. The GLOBALFOUNDRIES service has been first rate, the design enablement and field engineering teams gave us tremendous support from the outset of the engagement, and worked with us to build a very effective working relationship. We rely on GLOBALFOUNDRIES as a technology partner and recommend them to others.” For more details about GTC 2011, please visit: http://www.globalfoundries.com/gtc2011/. About GLOBALFOUNDRIES GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global manufacturing and technology footprint. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of advanced technology, manufacturing excellence and global operations. With the integration of Chartered Semiconductor in January 2010, GLOBALFOUNDRIES significantly expanded its capacity and ability to provide best-in-class foundry services from mainstream to the leading edge. GLOBALFOUNDRIES is headquartered in Silicon Valley with manufacturing operations in Singapore, Germany, and a new leading-edge fab under construction in Saratoga County, New York. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom. For more information on GLOBALFOUNDRIES, visit http://www.globalfoundries.com. CAUTIONARY STATEMENT This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include, without limitation, statements regarding the company's current expectations, assumptions, assessments, anticipations, objectives, plans, hopes, beliefs, intentions or strategies regarding the future. These forward-looking statements therefore are subject to risks and uncertainties which could cause actual results to differ materially. Some factors which contribute to these risks and uncertainties include the economic conditions both in the United States and around the world; the difficulties in developing new customers; the demand and supply outlook in the overall semiconductor / foundry industry; the sourcing strategy of potential customer base; competitor actions; the success of company technology alliances; construction progress on additional manufacturing facilities as well as associated governmental processes; the availability of components and equipment; labor and employment issues at manufacturing facilities; the progression of advances in technology and processes; and unforeseen events. The company has no duty to update any forward-looking statements in this release based on new information or events.
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