Newest management addition will help drive transformation to leading-edge foundrySUNNYVALE, CA – May 13, 2009 – GLOBALFOUNDRIES, the new leading-edge semiconductor foundry company formed by a joint venture between AMD [NYSE: AMD] and Advanced Technology Investment Company (ATIC), today announced the appointment of Subramani Kengeri as vice president of design solutions. Kengeri brings more than 20 years of experience in technical and management positions in the semiconductor industry, most recently at Taiwan Semiconductor Manufacturing Company (TSMC), where he was senior director of design and technology platform and head of the North America Design Center. At GLOBALFOUNDRIES, he will report to Mojy Chian, who recently joined the company as senior vice president of design enablement. The design enablement team at GLOBALFOUNDRIES is dedicated to ensuring that customer designs can be brought to market in high volume on leading-edge technology, helping them differentiate their products and maximize competitiveness in their market segment. The design enablement team is headquartered in Sunnyvale, Calif., with global operations around the globe. “We are driving the transformation to a leading-edge foundry by leveraging talent from the industry’s top foundries and fabless semiconductor providers,” said Doug Grose, chief executive officer of GLOBALFOUNDRIES. “Subramani brings a wealth of leading-edge foundry experience, and he clearly understands the technical and business challenges of design enablement on advanced technology nodes.” At TSMC, Kengeri’s global team was chartered with developing advanced design solutions for system-on-a-chip enablement and supporting technology co-optimization on advanced process nodes. He was the primary executive technical owner on many critical design enablement programs at TSMC. “GLOBALFOUNDRIES entered the market with capacity, capabilities, and a differentiated value proposition,” Kengeri said. “I am excited about the opportunity to help rapidly build the customer-facing functions that are so critical for success in the foundry industry.” Prior to joining TSMC, Kengeri held various engineering and management positions at Texas Instruments, Silicon Access Networks, Virage Logic, and others. He has led worldwide architecture, research and development, and yield improvement teams working closely with system-on-a-chip architects and process R&D. Kengeri has been issued 24 U.S. patents, and he serves on the conference committees for CICC and ISLPED. He holds a master’s degree in electrical engineering from the Indian Institute of Technology and a certificate in executive management from AeA/Stanford University. ABOUT GLOBALFOUNDRIES GLOBALFOUNDRIES is the world’s first truly global leading-edge semiconductor manufacturing company. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of leading-edge technology, manufacturing excellence and global operations. GLOBALFOUNDRIES is headquartered in Silicon Valley with facilities in Austin, Dresden and New York. For more information on GLOBALFOUNDRIES, visit www.globalfoundries.com CAUTIONARY STATEMENT This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include, without limitation, statements regarding the company's current expectations, assumptions, assessments, anticipations, objectives, plans, hopes, beliefs, intentions or strategies regarding the future. These forward-looking statements therefore are subject to risks and uncertainties which could cause actual results to differ materially. Some factors which contribute to these risks and uncertainties include the economic conditions both in the United States and around the world; the difficulties in developing new customers; the demand and supply outlook in the overall semiconductor / foundry industry; the sourcing strategy of potential customer base; competitor actions; the success of company technology alliances; construction progress on additional manufacturing facilities as well as associated governmental processes; the availability of components and equipment; labor and employment issues at manufacturing facilities; the progression of advances in technology and processes; and unforeseen events. The company has no duty to update any forward-looking statements in this release based on new information or events.
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