GLOBALFOUNDRIES offers a broad range of manufacturing capabilities, from leading edge to more mature, cost-effective process technologies. The company operates both 300mm and 200mm fabs including production at 28nm, 14nm FinFET and a roadmap to 10nm and below. The company invests in the most advanced and sophisticated equipment and processes to ensure the highest degrees of quality, reliability and cost-effectiveness for its customers. All of GLOBALFOUNDRIES fabs are ISO9001, ISO 14001 and ISO/TS16949 certified. Three of the fabs have been recognized as Fab of the Year by Semiconductor International Magazine.

In addition, GLOBALFOUNDRIES offers a full suite of solutions that are tuned to the unique needs of specialty applications in analog, mixed-signal and RF markets. These solutions combine proven, cost effective manufacturing technology with a robust ecosystem of support for specific market segments.

GLOBALFOUNDRIES customers have access to the foremost innovations in semiconductor manufacturing, including such advancements as High-k metal gate, silicon on insulator (SOI), low power technologies, and other breakthroughs that address the challenges of scaling with Moore's Law.

As the world’s first truly global foundry, GLOBALFOUNDRIES operates in five locations on three continents:

East Fishkill

East Fishkill, New York

  • Capacity: 14,000 wafers/month (300mm)
  • Technology: 90nm to 22nm


Malta, New York

  • Capacity: Up to 60,000 wafers/month (300mm)
  • Technology: 28nm, ≤  14nm


Burlington, Vermont

  • Capacity: 40,000  wafers/month (200mm)
  • Technology: 350nm to 90nm


Dresden, Germany

  • Capacity: 60,000 wafers/month (300mm)
  • Technology: 45nm to 28nm



  • Capacity: 68,000 (300nm)  93,000 (200nm) wafers/month
  • Technology: 180nm to 40nm