GLOBALSOLUTIONS at GTC 2011
Driving Innovation through True Collaboration

We invite you to visit our partners and find out how joint collaboration makes it possible to share IP and development expertise as well as reduce R&D investments.

• Assembly and Test Partners
• EDA Partners
• Channel Partners
• Design Services Partners
• IP Partners
• Mask Services Partners
• Industry Alliance Partners

View Partner Pavilion Floorplan

Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test.

ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. The Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe & bump, substrate, IC assembly, final test and electronic manufacturing services. Please enquire about ASE's Copper wire bond solutions. www.aseglobal.com

A joint-venture entity incorporated in Singapore, Nepes Pte Ltd is recognized as a reliable IC Packaging Solution Provider in Advanced Flip Chip Wafer Bumping, and wafer level package technologies within domestic and worldwide Supply Chain Operations.

Together with our head office, Nepes Corporation Korea, we have established all key activities; Manufacturing, Design services, R&D to be located within the Asia region.

Focused on 200 & 300mm Flip Chip, Wafer Level ChipScale Packages (WLCSP), Fan-Out Wafer Level Packaging (FOWLP) within our existing portfolio, Nepes provides Foundry type bumping services and other related Packaging services to meet the requirements of our global top tier customer base.

Nepes Pte Ltd (Singapore) has been working with GLOBALFOUNDRIES since our inception in 2006 for 65nm wafer technologies. Since then, we have been an integral partner for the GLOBALFOUNDRIES Ecosystem for advanced technologies supply chain.

STATS ChipPAC is a leading service provider of semiconductor design, bump, probe, packaging, test and distribution solutions for the communications, computer and consumer markets. STATS ChipPAC offers a broad portfolio of services and advanced process technology including wafer level, flip chip and 3D packaging. With a global manufacturing presence spanning Singapore, South Korea, China, Malaysia, Thailand and Taiwan, STATS ChipPAC delivers innovative, cost effective semiconductor solutions. As one of the first partners in GLOBALFOUNDRIES' Global Alliance for Advanced Assembly Solutions, STATS ChipPAC has been working to jointly to develop packaging and test solutions for smaller, faster, more complex devices with optimum performance and manufacturability at advanced technology nodes. STATS ChipPAC is proud to be a member of GLOBALFOUNDRIES' global collaboration ecosystem and is focused on developing integrated packaging solutions that will provide customers the maximum choice and flexibility, while delivering cost savings and faster time-to-volume in today's competitive market.

Visit Apache Design Solutions to learn about how Apache's platforms are used in the jointly developed 28-nm-SLP sign-off ready flow that enables designers to perform early prototyping, circuit optimization, and full-chip sign-off. The suite of Apache products employed in the sign-off ready flow includes RedHawk™, a production proven power sign-off platform for large scale SoCs and ultra-low power design techniques, and Totem™ that offers power, noise, and reliability sign-off for analog/mixed-signal designs. Apache's industry proven sign-off solutions for digital and custom IC power supply noise, electro-migration (EM), and electro-static discharge (ESD), help enable our mutual customers to predict and manage power related issues in their designs with a robust solution to meet low-power demands.

Apache advances low-power innovation and enables power-efficient, high-performance, noise-immune electronic designs. Meet with our Power Team experts to learn how Apache's Ultra-Low-Power, IP Integration, and CPS solutions can help meet your low-power requirements and reduce costs.

Cadence Design Systems, Inc. is the global leader in software, hardware, methodologies, and services that play essential roles in accelerating innovation in today's highly complex integrated circuits, printed circuit boards, and electronics systems. Companies use Cadence(r) electronic design automation (EDA) technologies and engineering services to design, verify, and prepare advanced semiconductors and systems for manufacturing. These products, in turn, form the foundation of the more than $1 trillion worldwide electronics market, which is increasingly being driven by consumer-oriented products. The major vertical market segments include computers, wired and wireless communications, and consumer electronics, such as multimedia and personal entertainment devices. Globally, these account for 75 percent of electronics equipment revenue and more than 90 percent of semiconductor revenue. The major horizontal segments are systems companies, semiconductor companies, and silicon providers (ASIC vendors, foundries, and FPGA companies). Cadence is a leading provider of EDA solutions in each of these segments, giving the company unparalleled visibility into the electronics design industry.

Helic provides Electronic Design Automation (EDA) software tools and semiconductor intellectually property (IP), with a mission to enable increased levels of miniaturization for semiconductor-based wireless and broadband systems. We are a world leading provider of rapid electromagnetic modeling and high frequency synthesis and extraction/verification technologies. In more than a decade of service to leading semiconductor companies, we are revolutionizing the way ICs and modules are being designed, verified, and manufactured.

Infinisim's RASER® circuit simulator guarantees bang-on SPICE accurate results for multi-million transistor designs with orders of magnitude higher throughput over other leading SPICE simulators. Infinisim's Real-time Adaptive Simulation™ technology is particularly well suited for mixed-signal and digital designs at advanced technology process nodes where accurate simulation of large designs has become critical and where existing FastSpice tools are unable to deliver the required level of accuracy.

Targeting designs requiring SPICE accuracy and large capacity, RASER's applications include advanced digital clock trees, critical path pruning and low power designs. RASER provides:

• SPICE accurate skew and slew timing verification for clock-trees and clock-mesh designs
• Tighter tolerances within STA flow for performance optimization to reduce guard banding
• Simulation of entire clock tree in conjunction with PLL for accurate jitter analysis
• Post-layout verification
• Silicon-accurate leakage currents and power
• Variational analysis of 28nm designs to accurately assess OCV via Spice-level Monte-Carlo analysis

RASER has also been extensively used for large mixed-signal designs (e.g., SerDes, ADC, PLL/DLL), for SPICE accurate, higher verification throughput and coverage.

Integrand Software's EMX is used to design high frequency, RF and Mixed Signal ICs for the global semiconductor industry. EMX is a full wave, 3D electromagnetic simulator and modeling tool. EMX is very accurate, very fast and very easy to use. EMX allows designers to accurately and efficiently simulate large RF circuit blocks, synthesize and characterize the behavior of passive components (such as inductors, transformers and MOM capacitors) and analyze the parasitics due to interconnect. EMX is typically used to design VCOs, LNAs, RF transceivers and analyze coupling between sensitive RF blocks.

GLOBALFOUNDRIES has partnered very closely with Integrand over the last several years. They have been using EMX to characterize passive components such as inductors, transformers and MOM capacitors. In fact, the Optimum Inductor Finder (OIF™) technology deployed by GLOBALFOUNDRIES for inductor synthesis has been developed using Integrand's EMX. GLOBALFOUNDRIES has done extensive verification of the models generated by EMX on a variety of RFCMOS technology nodes (ranging from 180nm to 28nm) and have found them to correlate very well with RF measurements on silicon.

Reliability is a growing concern with small process nodes, sensitive to internal variations (process, manufacturing) and environmental conditions (radiations, temperature). More chips are expected to fail in the field than ever before. Radiations cause Single Event Effects in digital CMOS throughout the product life in the field. Careful design with the proper tools helps reduce drastically this liability.

iRoC Technologies is expert in this field and developed over the past 10 years analysis and prediction EDA tools at the cell level (TFIT™) and circuit level (SOCFIT™). TFIT predicts quickly and accurately the cells FIT (Failure in time) from netlist and layout, and the foundry's response model. TFIT is mainly used for characterizing and optimizing memories, FF, registers and combinational cells. SOCFIT predicts ASIC FIT and derating factors using either RTL or Netlist representations and output from TFIT (cell FIT rates). It helps architects budgeting and optimizing mitigation solutions to enhance reliability.

GLOBALFOUNDRIES and iRoC Technologies are cooperating to develop the 40nm and 28nm response models available within the PDK to customers using TFIT.

Lorentz Solution, Inc. supplies EDA products focused on cost-sensitive RF and high-speed semiconductors at advanced process nodes. The PeakView™ EM Design Platform provides silicon predictability through high-accuracy EM-based synthesis, extraction and modeling. Integrated with industry standard EDA design and PDK platforms, PeakView removes barriers letting chip designers perform their own EM device design and circuit level EM verification for predictable circuit performance and reduced chip area.

Lorentz and GLOBALFOUNDRIES have had a long standing relationship. As a customer of Lorentz, GLOBALFOUNDRIES uses the PeakView Design Platform for internal R&D. As a partner of GLOBALFOUNDRIES, Lorentz provides design-flow centric EM solutions including modeling of CMP effects for mutual customers developing RF and high-speed analog designs.

Magma's software provides the "Fastest Path to Silicon"™ and enables the world's top chip companies to create high-performance integrated circuits (ICs) for a wide range of applications. By partnering with GLOBALFOUNDRIES and being part of GLOBALSOLUTIONS, Magma ensures that our mutual customers have access to a comprehensive design-to-manufacturing ecosystem that enables them to meet the toughest performance, power, time-to-market and cost requirements. At GTC 2011, Magma will present the Talus-Flow-Manager-based netlist-to-GDSII reference flow for GLOBALFOUNDRIES' 28-nmSLP process.  This out-of-the-box design flow allows engineers to easily tune the reference flow for specific applications, or quickly import existing Talus designs to enable fast process analyses and investigations.  Information on GLOBALFOUNDRIES-qualified Quartz™ DRC and Quartz LVS runsets, and Tekton timing analysis, FineSim™ circuit simulation, Titan™ analog design, SiliconSmart® ACE characterization and QuickCap® extraction tools will also be available. For more information visit www.magma-da.com.

Mentor works with both GLOBALFOUNDRIES and the ISDA alliance to provide integrated solutions that address the full scope of electronic system design, from system level to IC design, verification, mask optimization, test and yield analysis. The Mentor design-to-silicon environment is a primary interface between GLOBALFOUNDRIES' customers and its leading edge manufacturing processes. Close collaboration between Mentor and GLOBALFOUNDRIES produces a differentiated offering that allows customers to tune their designs to gain competitive advantage in performance, power, reliability, yield or other key parameters. Mentor currently supports all nodes to 28nm, with 20nm under active development. The Mentor Calibre platform is the primary RET/OPC and PV sign off solution at GLOBALFOUNDRIES for all nodes, while the Olympus-SoC P&R system is qualified to 28nm and is being extended to 20nm with Double Patterning features. The GLOBALFOUNDRIES' DRC+ solution for litho hotspot prevention is based on Calibre pattern matching technology, and we have jointly deployed a yield analysis methodology that helps customers rapidly eliminate design-based yield detractors to accelerate their yield ramp and improve reliability. Mentor also provides comprehensive SoC test solutions including scan-based, BIST, and 3D-IC test.

SpringSoft, Inc. is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas™ Verification Enhancement and Laker™ Custom IC Design solutions used by more than 400 of today's leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world.

Through our Laker Custom IC solutions, SpringSoft is a supplier, partner and supporter to major foundries and technology leaders around the world like GLOBALFOUNDRIES. The Laker platform runs natively on OA and provides a top-tier custom IC design platform including circuit design, schematic-driven layout, custom digital place and route, and a world-class network of partners to create best-in-class flows for even the most challenging technologies. For more information, visit www.springsoft.com.

Synopsys is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, IP and services used in semiconductor design and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and FPGA solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, system-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk.

MOSIS is a low-cost prototyping and low-medium volume production semiconductor Foundry service. Since 1981 MOSIS has fabricated over 50,000 circuit designs for commercial firms, government agencies and research and educational institutions around the world. MOSIS provides designers with a single interface to the constantly changing technologies and options available from the semiconductor industry. Mask generation, wafer fabrication, test and device packaging are contracted to leading industry partners. In addition to MPW (multi project wafer) services MOSIS also offers the option to provide dedicated Engineering runs and full production wafers.

Open-Silicon provides leading edge semiconductor solutions including traditional ASIC design, derivative SoC design, and full manufacturing operations. In addition to a broad menu of in-house engineering capabilities, Open-Silicon also utilizes the best-in-class engineering capabilities of partners. By combining the specific expertise necessary for each design with the most appropriate open market technologies, and managing the process through a single point of ownership, Open-Silicon has raised collaborative engineering to a new level.

Since its founding in 2003, the company has focused on excellence in SoC execution, measuring the quality of engineering work and the ability to hit customer schedules and reporting that to the board of directors at every board meeting. Also, the company has invested in technology, from the 2007 acquisition of Zenasis Technology, a leader in the processor performance optimization space, to the 2009 acquisition of Silicon Logic Engineering, a leader in networking and computer system architecture, to the in-house developments of scan shift frequency scaling (TestMAX) and back biasing (VariMAX). www.open-silicon.com

Socle Technology Corporation, founded in 2001 and invested by GLOBALFOUNDRIES since December 2009, is well-recognized as a leading-edge provider of SoC design and implementation services as well as an architect for more complicated SoC design technology in advanced process nodes. As a strategic partner, Socle has developed some of the best ARM hard cores and ARM embedded SoC platforms among ARM solution providers worldwide. Socle's multicore processors include ARM Cortex A9 and series products for next generation platform solutions. For the best design service with the one-stop-shop convenience, Socle enables designs through GLOBALFOUNDRIES and works closely with other world-class partners of IP, EDA, and assembly and testing. www.socle-tech.com

Founded in 2002, VeriSilicon Holdings Co., Ltd. (VeriSilicon) is a fast growing IC design foundry providing custom silicon solutions and SoC turnkey services. VeriSilicon's technology solutions combine licensable digital signal processing (ZSP®) cores, eDRAM, value-added mixed signal IP portfolio and other star IP into a SoC platform that extends below 65nm process technology. These platforms benefit a wide range of consumer electronics devices such as set top box and Home Gateway, mobile internet device and Cellular Phone, HDTV and Blu-ray DVD Player. VeriSilicon's design and manufacturing service provides differentiation based on specific customer requirement that ranges from initial SoC specification and application software, RTL and back-end design implementation through silicon samples and volume production, utilizing multiple foundry partners, assembly and test companies in Asia and US.

VeriSilicon is certified by GLOBALFOUNDRIES as a GLOBALSOLUTIONS ASIC partner. It currently has research and development centers Shanghai and Beijing, China; Santa Clara and Dallas, US; Oulu, Finland; with sales and customer support offices in Santa Clara, US; Shanghai, Beijing and Shenzhen, China; Tokyo, Japan; Taipei and Hsinchu, Taiwan; Soul, Korea; Nice, France and Munich, Germany.

Infotech Enterprises is a leading-edge engineering solutions provider with 8700+ engineers across 30 global locations specializing in product development, lifecycle support, process, network and content engineering to major organizations worldwide. Infotech provides "concept to silicon and system prototype" solutions for ASIC/FPGA Engineering and Embedded Software Development with a 12-year impeccable track record of "first pass success" on 200+ design projects across various nodes up to 28nm. Infotech's proven and proprietary design flows in silicon engineering enable our customers to shorten their product development cycle which ensures that our customers always stay ahead.

We adopt a proactive approach to serve our clients with our best-in-class delivery centers in North America, Europe, Middle East, and Asia Pacific. Our clients span multiple industries such as Aerospace, Consumer, Energy, Medical, Heavy Equipment, Rail, Semiconductor, Telecom and Utilities and include 22 "Fortune 500" and 27 "Global 500" blue chip organizations. Infotech Enterprises generated consolidated revenues of US $261 Million for the fiscal year ending March 2011 with a compound annual growth rate of 26%. www.infotech-enterprises.com

Lab to Fab™ — Transforming Next Generation Technology into Reality

SVTC is the premier innovation partner for accelerating nanotechnology development and commercialization. SVTC's proven advanced technology and secure IP infrastructure combined with our Technology Development Process supports companies developing MEMS, microfluidics, novel transistors, photovoltaics and other nanotechnologies for the Semiconductor, Life Science and Aerospace & Defense markets.

SVTC is engaged with GLOBALFOUNDRIES to drive technology development from Lab to Fab and accelerate high-volume MEMS manufacturing. SVTC provides access to its full-scale development facilities, allowing GLOBALFOUNDRIES to develop silicon-based solutions for customers using a full complement of advanced CMOS and MEMS equipment. SVTC also provides development support services and training on MEMS technology for GLOBALFOUNDRIES engineers.

Accelerating Time to Market, Reducing Development Costs and Risk

With access to SVTC's 250 production ready tools, multi-disciplined engineering team and 2500+ process recipes, customers can accelerate technology development quickly and cost effectively. The 95,000 square feet of 24/7 cleanroom space is an IP-secure environment that is accessible by customer engineers. SVTC's Technology Development Process accelerates next generation technology time to market by developing a production ready process that can be transferred to high volume manufacturer. www.svtc.com

Synopsys' Lynx Design System is a tape-out proven, chip design environment that delivers a production-proven design flow with innovative visualization capabilities to help you create and track your design all the way from RTL through GDSII. Developed by chip designers for chip designers, the Lynx Design System leverages a tapeout-validated implementation flow based on the industry-leading Synopsys Galaxy Implementation Platform. It improves designer productivity and schedule predictability for IC design.

The Lynx Design System encapsulates the collective experience of Synopsys and its foundry and third-party IP partners through established flows and recommended tool settings, enabling rapid set-up and ease-of-use for design teams of all sizes. The Lynx Design System automates the configuration of pre-validated foundry data to accelerate project start and embeds technology-specific checks to streamline tapeout to the foundry. The Lynx Design System is an open environment that readily accommodates customers' internal or third-party vendor tools.

Its patented visualization technology for design creation, data capture and project metrics reporting creates an environment that enhances the efficiency of designers and program managers alike.

Alvand Technologies is a leading analog IC design company that specializes in high-speed, low-power, and ultra small die area data converters (ADC/DAC) and Analog Front End (AFE). These data converters and AFEs can be used in a broad range of applications, such as MIMO wireless (LTE, Wi-MAX, Wi-Fi) systems, Video AFEs, and mobile TV. By collaborating with GLOBALFOUNDRIES as an IP provider, Alvand has developed an advanced MIMO Analog Front-end IP solution in 40nm for deployment in the next generation of global wireless solutions. Alvand also provides full turnkey mixed-signal ASICs based on its high-performance and low-power IPs. For more information visit us at http://www.alvandtech.com.

Analog Bits, Inc. is the leading supplier of integrated timing and interconnect IP. Products include precision clocking macros such as PLL's & DLL's, programmable interconnects such as multi-protocol SERDES/PMA and programmable I/O's as well as specialized memories such as high-speed SRAMs and T-CAMs. With billions of uses of IP fabricated in customer silicon from 0.35-micron to 28-nanometer processes, Analog Bits has the heritage of "first time working silicon" at merchant foundries and IDMs.

Aragio Solutions is recognized worldwide as a premier IP provider of innovative I/O Library Solutions and has maintained a strategic partnership with GLOBALFOUNDRIES since 2003. Aragio has an excellent track record of silicon success by providing ESD protection solutions for I/O libraries used on numerous CMOS processes. Aragio has developed robust ESD protection and high latch-up immunity IP for System Interface Circuits enabling high performance operation for standard interfaces (USB 2.0/3.0 IO's, DDR2/DDR3, mDDR/LPDDR2, LVDS, RF and Analog ESD protection circuitry) and other high speed interface peripherals. ARAGIO's innovative integrated circuit technology has enabled silicon-efficient I/O libraries on 65nm Common Platform process technologies. Aragio's innovative I/O solutions address the key technology needs at 65nm, 40nm, and 28nm advanced nodes. Contact Aragio at 972-516-0999 or sales@aragio.com.

ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes industry leading microprocessors, graphics processors, video engines, connectivity products, enabling software and tools.

In addition, ARM offers a comprehensive portfolio of Artisan® advanced physical IP including standard cell libraries, embedded memories, high-speed connectivity and processor optimized packs (POPs) to ensure a reduced time-to-market design cycle.

ARM's strategic collaboration with GLOBALFOUNDRIES provides optimized Systems-On-Chip (SoC) solutions for ARM processors tuned to GLOBALFOUNDRIES manufacturing processes covering a wide range of process nodes from 250nm to 20nm.

The ChipEstimate.com chip planning portal is an ecosystem comprised of over 200 of the world's largest IP suppliers and foundries. These companies share in the common vision of helping the worldwide electronics design community achieve greater profitability and success. To date, over 35,000 users have joined the ChipEstimate.com community and have collectively performed over 130,000 chip estimations. ChipEstimate.com provides design teams with the latest information on semiconductor IP and software required to automate the estimation and planning of future chip designs. GLOBALFOUNDRIES has partnered with ChipEstimate.com to create a rich, freely accessible database of IP components to enable their customers to achieve design success. Learn more at www.ChipEstimate.com.

Cosmic has a number of IPs enabled in the GLOBALFOUNDRIES process ranging from the mature 0.18um technology down to the advanced 28nm technology. The IPs include PLLs, Data Converters, Analog-Front Ends, Audio Codecs and Power Management. Cosmic provides an extensive PLL portfolio in GLOBALFOUNDRIES technology supporting the 0.18um, 0.11um, 65nm, 55nm, 40nm and 28nm nodes with different applications including but not limited to spread-spectrum and fractional-N clock synthesis.

GLOBALFOUNDRIES' 65nm is a sweet spot for Cosmic Circuits IP enablement with the GLOBALFOUNDRIES Technology. The IPs available in this process are monitoring SAR ADCs, high-speed wireless analog front-ends, video DACs, low-jitter PLLs, DC/DC converters supporting 1.62 – 4.2V input supply, LDOs, PORs and Audio Codecs. Cosmic Circuits is committed to IP development in the advanced process technologies from GLOBALFOUNDRIES and will soon have silicon availability of their 28nm PLLs. Cosmic Circuits also expects to tape-out their high-speed wireless analog front-end in the 28nm technology within this year.

eMemory was one of the industry's technology developers to concentrate explicitly on logic-based embedded NVM technologies, beginning as early as 2000. By late 2002, eMemory had fully qualified and subsequently licensed the company's first embedded NVM IP technology — NeoBit — to Chartered Semiconductor of Singapore (now GLOBALFOUNDRIES).

The early successful partnership with GLOBALFOUNDRIES — the first foundry to foresee the potential of embedded NVM IP in increasingly sophisticated SoC designs — resulted in cooperation opportunities with leading fabless design houses, and, eventually, to cooperate with other world-class foundries and integrated device manufacturers.

eMemory followed the success of NeoBit with the successful introduction of NeoFlash in 2008, a programmable non-volatile memory that would allow customers to embed flash memory right into their system-on-chip devices. In 2009, eMemory followed again with NeoEE, giving customers a viable and highly cost-competitive alternative to external EEPROM.

Kilopass Technology, Inc., a leading supplier of embedded non-volatile Memory (NVM) intellectual property (IP), leverages standard logic CMOS processes at foundry partner GLOBALFOUNDRIES to deliver one-time programmable (OTP) and many-time programmable (MTP) IP memory blocks.  Kilopass Technology's highly reliable and cost-effective IP blocks are ready to integrate with a customer's custom logic and other IP blocks to quickly add secure OTP NVM capabilities to new designs.  Kilopass Technology's product lines have been qualified in GLOBALFOUNDRIES' advanced 40nm process technology:  eXtra Permanent Memory (XPM) OTP family, which ranges up to 1Mb in capacity; Gusto OTP memory family, which ranges up to 4Mb; and Itera MTP, which ranges up to 1Mb. The first two are qualified in GLOBALFOUNDRIES' mature 0.13um/0.11um processes.  The products are also in evaluation on GLOBALFOUNDRIES' 65nm process technology.  As GLOBALFOUNDRIES' process technology scales to smaller geometries, Kilopass memories will achieve smaller areas, lower active and standby power, and higher performance. This results in lower cost embedded NVM OTP solutions.

Mixel® is a leading provider of differentiated mixed-signal IP cores to the semiconductor and electronics industries, with a particular focus on low-power mobile applications such as MIPI and MDDI. Our silicon-proven IP cores utilize a Legorithmic™ approach and are highly configurable for a wide range of applications. Mixel's mixed-signal IP portfolio includes high-performance PHYs, SerDes, Transceivers, PLLs, and DLLs.

Mixel has a long history of collaboration with GLOBALFOUNDRIES as a mixed-signal IP partner, going back to Chartered Semiconductors. Mixel has many silicon-proven IP in GLOBALFOUNDRIES such as the MIPI D-PHY and the 4.25Gbps multi-standard SerDes.

Mixel D-PHY operates up to 1.5Gbps exceeding the current MIPI D-PHY standard in anticipation of the next specification release. Mixel offers a MIPI Platform incorporating its D-PHY test chip and daughter card together with an off-the-shelf FPGA board that supports all D-PHY use-cases such as CSI and DSI.

The MXL-SRDS-4254 is a Multi-standard SerDes that operates over a wide range of data-rates, from 1Gbps to 4.25Gbps, and is highly programmable SerDes.

For more information please visit the Mixel website.

MoSys, Inc. is a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems. MoSys' Bandwidth Engine' family of ICs combines the company's patented 1T-SRAM high-density memory with its high-speed interface technology. A key element of Bandwidth Engine technology is the GigaChip™ Interface, an open, short-reach, low-power serial interface developed by MoSys to enable highly efficient, high-bandwidth, low-latency performance not achievable using currently available serial protocols. MoSys' IP portfolio includes silicon proven SerDes and DDR3 PHYs that support a wide range of data rates across a variety of standards and 1T-SRAM memory cores that provide a combination of high-density, low power consumption, high-speed and low cost advantages for high-performance networking, computing, storage and consumer/graphics applications.

S3 Group is the Connected Consumer Technology company, providing expert consumer systems and technology design capabilities. S3 Group's IP and professional services enable its' clients to design and deliver next-generation devices, systems and services to consumers at home and on the move.

For semiconductor designers and product managers, S3 Group delivers a comprehensive portfolio of high performance silicon proven RF, analog, mixed-signal IP, and design services for power-efficient single-chip systems. S3 Group enables its' customers to meet tight time-to-market schedules with reduced design risk. Our portfolio of silicon proven RF, analog and mixed-signal IP includes the following geometries: 0.18u, 0.13u, 90nm, 65nm, 40nm.

Founded in 1986, S3 Group is headquartered in Dublin, Ireland and has offices and sales representatives across Europe, North America and Asia.

Sidense Corp. provides secure, very dense and highly reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required and no impact on product yield. The Company's patented one-transistor 1T-Fuse™ bit-cell architecture provides the industry's smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (NVM) IP solution. With over 70 patents granted or pending, Sidense 1T-OTP macros provide field-programmable alternative solutions to Flash, mask ROM and eFuse in many OTP and MTP applications and can operate in an emulated MTP (eMTP) mode for the latter.

As a part of the GLOBALSOLUTIONS IP Ecosystem, Sidense offers OTP products at several GLOBALFOUNDRIES process nodes that are used by semiconductor companies in a wide variety of applications. Overall, Sidense 1T-OTP macros are available from 180nm down to 40nm and are scalable to 28nm and below. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.

Synopsys offers a broad portfolio of high-quality, silicon-proven digital, mixed-signal and verification IP for system-on-chip designs. As the leading provider of connectivity IP, Synopsys delivers the industry’s most complete solutions for widely used protocols such as USB, PCI Express®, DDR, SATA, Ethernet and AMBA®. In addition to connectivity IP, Synopsys offers SystemC transaction-level models to build virtual platforms for rapid, pre-silicon development of software. When combined with a robust IP development methodology, reuse tools, extensive investment in quality and comprehensive technical support, DesignWare® IP enables designers to accelerate time-to-market and reduce integration risk.

True Circuits, Inc. (TCI) is the leading provider of high performance and general purpose timing IP for the semiconductor, systems and electronics industries. TCI's robust state-of-the-art circuits, methodical and proven design strategy, and close association with GLOBALFOUNDRIES has enabled us to silicon-validate and support the largest portfolio of high quality, low-jitter and standardized PLL and DLL IP available in a range of frequencies, multiplication factors, sizes and functions on GLOBALFOUNDRIES' processes from 180nm to 28nm.

TCI's timing IP spans nearly all performance points and features typically requested by ASIC, FPGA and SoC designers, including the precise timing requirements for the latest DDR, SerDes, video and other interface standards. Whether your requirements are simple or highly complex, TCI can provide standard off-the-shelf or full custom timing IP to help you develop highly differentiated products that win. Over the last 13 years, TCI has distinguished itself as the technology leader in the timing space, and our IP designs are used extensively around the world in our customers' products with production volume now in the billions.

DNP (Dai Nippon Printing Co, Ltd.) is recognized as the market leader and pioneer in photomask technology. DNP is dedicated to maintaining this position and consistently accelerating next generation development through continued focus on "in-house" and collaborative R&D efforts. Through significant investment in R&D and advanced manufacturing capacity, DNP is able to maintain its technological expertise to satisfy the complex technical demands of today and well into the future. The DNP photomask advantage consists of a strong technology focus by accelerating next-generation development and staying ahead of the technology curve, a comprehensive customer support through a wide range of support tools and capabilities, and collaboration with key industry leaders, which provides customers with access to the industry's most advanced photomask technologies. Find out more at http://www.dnp.co.jp/eng/.

Toppan Electronics is a premier supplier to the electronics industry, providing a wide range of products, including Photomasks. Our photomask business uses a global network of production sites and data centers supporting our global customer base. We produce a full range of photomask products, for multiple end use applications, at design rules (starting at 20nm) and in formats to support a wide variety of image transfer applications.

The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation. The Alliance addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions.

Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 30 countries worldwide.

GLOBALFOUNDRIES has been a GSA member since 2009 and has a foundry seat on the Alliance's Board of Directors.

GSA Events 2011
GSA & OCTANe Semiconductor Summit  •  Newport Beach, CA  •  09.08.11
GSA Semiconductor Ecosystem Summit  •  Santa Clara, CA  •  10.06.11
Silicon Series Luncheon  •  Boston, MA  •  10.20.11
Silicon Series Luncheon  •   Austin, TX  •  10.27.11
GSA Semiconductor Leaders Forum Taiwan  •  Taipei, Taiwan  •  10.26.11
GSA Awards Dinner Celebration  •  Santa Clara, CA  •  12.08.11
www.gsaglobal.org

New York's Capital Region and Saratoga County is now home to GLOBALFOUNDRIES Fab 8. The region offers a highly-skilled workforce, proximity to major markets, superior sites and infrastructure and competitive incentives. With vibrant, thriving communities, diverse and friendly neighborhoods, award-winning schools and healthcare; once you're here, you won't want to leave. From research and design, to commercialization and manufacturing, you'll find all of the resources you'll need to succeed.

The Saratoga Economic Development Corporation (SEDC) and the Center for Economic Growth (CEG) led the economic development initiative which attracted GLOBALFOUNDRIES to Saratoga County and the Capital Region of New York. This economic development team is ready to assist you with your site selection and business development needs. Please visit www.saratogaedc.com or www.ceg.org for more information.