GTC 2011 - "Driving Innovation through True Collaboration"
Capacity Crowds Attend in Santa Clara, Hsinchu, and Shanghai
Under the banner “Driving Innovation through True Collaboration”, GLOBALFOUNDRIES CEO Ajit Manocha reiterated the vision and commitment to technology innovation, globally diversified capacity and flexible regionalized service at GTC 2011. Several product demos and case studies were described powerfully by a long list of customers and partners including AMD, Broadcom, Inside Secure, Lightwire, Rambus, Samsung, and ST.
Plenary Session in Main Ballroom Santa Clara Convention Center
These demos and case studies demonstrate how GLOBALFOUNDRIES serves some of the largest semiconductor companies in the world across the entire spectrum of electronics products from 0.5um EEPROM for automotive electronics to technology development at 20nm for next generation application processors for smart phones and tablets. Customers such as Lightwire and Inside Secure also spoke about how GLOBALFOUNDRIES is a trusted partner for small start-up companies, an important historic engine for innovation and growth in the semiconductor industry.
Leading in Innovation Awards
GLOBALFOUNDRIES announced the winners of its new “Leading in Innovation” awards, presented to customers who have demonstrated innovative solutions on products ranging from 0.35um non-volatile memories for near field communication to leading-edge 28nm smart phone processors, the awards showcase the company’s collaborative approach to enabling chip designers to deliver a superior end-user experience. Two categories were recognized, "Innovative Mobile Solutions" and "Emerging Hot Startup", with brief summaries below. Read more >>
- Innovative Mobile Solutions
- Broadcom Corporation, for its mobile connectivity combo chips, currently manufactured on GLOBALFOUNDRIES' 65nm low power technology.
- Inside Secure, for its MicroRead near-field communication (NFC) solution, manufactured on GLOBALFOUNDRIES' 0.35um-EEPROM technology, and planned for production on 0.13um-EEPROM.
- Rambus, for its high-speed low-power next-generation memory technologies developed on GLOBALFOUNDRIES' 28nm-SLP technology.
- STMicroelectronics, for its technology development used in ST-Ericsson's leading edge Nova A9600 smartphone application processor, planned for production on GLOBALFOUNDRIES' 28nm-SLP technology.
- Emerging Hot Startup
- Lightwire, for its LWS1040-LC 10G optical transceiver module, containing a CMOS photonics circuit manufactured on GLOBALFOUNDRIES' 130nm-RF technology, and 10G driver and receiver, manufactured on GLOBALFOUNDRIES' 65nm process.
GLOBALFOUNDRIES customers and partners made a strong case for foundry leadership in each of the following arenas - (1) Innovation and technology, (2) Globally Diversified Capacity, and (3) Flexible Regionalized Service. Highlights are summarized below:
Innovation and technology: GLOBALFOUNDRIES is the only foundry shipping High-K Metal Gate (HKMG) products, and will out ship all other foundries combined by a wide margin in 2011, with multiple products available in stores since 1H2011. All of this production is “Gate-First” HKMG, providing outstanding performance and unmatched die size reduction vs. 40nm, with a cost saving of 10-20% vs. the “Gate-Last” schemes provided by other foundries at 28nm. Innovation in both 300mm and 200mm technologies was showcased across all technology nodes with Value Added Solutions in RFCMOS, embedded non-volatile memories, and BCD-Lite™
High voltage for the consumer, communication, computing and automotive /industrial segments. Read more >>
Globally Diversified Capacity: GLOBALFOUNDRIES’ global footprint of its own 300mm fabs across 3 continents, plus the FabSync agreement with Samsung, firmly puts GLOBALFOUNDRIES far ahead of all other foundries in global capacity. This is both in absolute terms and in terms of offering supply chain de-risking with its own network of global sites, and by combining with Samsung for a total of 4 large, geographically-dispersed fabs for 28nm and below capacity in Korea, the US, and Germany.
Flexible Regionalized Service: “Leading in Innovation Award” winners complimented GLOBALFOUNDRIES on building open and collaborative working relationships and being a supportive and responsive supplier. Rambus and ST collaborated on white papers with GLOBALFOUNDRIES on the compelling performance and low cost features of GLOBALFOUNDRIES’ 28nm technology. The Rambus white paper extols the analog and RF advantages of GLOBALFOUNDRIES 28nm, and acknowledges outstanding service in design enablement and assembly services. Read White Papers >>
More than 40 GLOBALSOLUTIONS ecosystem partners from EDA, IP, design service, mask, assembly and test exhibited in the GLOBALSOLUTIONS Pavilion in Santa Clara.
The CEO’s of ARM, Cadence, and Synopsys showed their support of GLOBALFOUNDRIES by attending GTC US and participating in an engaging panel on the future of foundry design enablement, moderated by GLOBALFOUNDRIES SVP Mojy Chian.
Cadence, Magma, Mentor Graphics, Synopsys and GLOBALFOUNDRIES announced a 20nm tape out, demonstrating readiness for customers to begin evaluating their 20nm designs. Read more >>
GLOBALFOUNDRIES and Samsung announced an extension of their FabSync agreement on their industry leading "Gate-First" HKMG 28nm-SLP to include a new solution 28nm-LPH for high performance mobile applications. The companies are proving the collaborative value of a synchronized platform by working with several customers to optimize processes and tooling for both the low-power and high-performance 28nm HKMG technologies. The synchronization process helps ensure consistent production worldwide, enabling customer chip designs to be produced at multiple sources with no redesign required, leveraging the customers' design investments. Read more >>
EDA/IP CEO Panel - Robert Hum, Warren East, Lip Bu Tan, Aart De Geus, Mojy Chian (left to right)
Amkor and GLOBALFOUNDRIES announced they entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes. Amkor becomes a founding member of GLOBALFOUNDRIES' new Global Alliance for Advanced Assembly Solutions, which is designed to accelerate innovation in semiconductor interconnect, assembly and packaging technologies. By joining forces, GLOBALFOUNDRIES and Amkor plan to extend the ecosystem to address growing market needs for 3DIC. Read more >>
GLOBALFOUNDRIES wishes to thank the customers and partners who attended GTC 2011. GLOBALFOUNDRIES offers a special thank you to the Platinum sponsors of GTC 2011 - ARM, Cadence, ChipEstimate.com, Mentor Graphics, and Synopsys.